Infineon highlights power electronics portfolio at APEC 2018 |
Munich, Germany and El Segundo, CA, USA - 16 February 2018 - Power semiconductor technologies based on advanced GaN, SiC and Si will share the spotlight in the Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) exhibit at the Applied Power Electronics Conference (APEC). From March 4-8, 2018, Infineon will showcase energy-efficient, reliable and cost-effective semiconductor system solutions that contribute to a better future. The exhibit (Booth 701) takes place at the Henry B. Gonzalez Convention Center, San Antonio, Texas. Exhibits and demonstrations will highlight the growing reliability and market maturity of wide-bandgap power technologies, as well as continued improvements in industry mainstay silicon-based MOSFETs and IGBTs. Infineon will be showing new XDP™ family digital controllers, intelligent power modules and audio drivers. Also on display are GaN-based boards for telecom, server and consumer electronics applications, SiC MOSFETs and diodes, and automotive-qualified inverter modules. Infineon will also participate in 15 sessions and seminars during APEC, including: Sunday March 4
For information on the APEC 2017 conference visit http://www.apec-conf.org/ |
About Infineon Infineon Technologies AG is a world leader in semiconductor solutions that make life easier, safer and greener. Microelectronics from Infineon is the key to a better future. In the 2017 fiscal year (ending 30 September), the Company reported sales of around €7.1 billion with about 37,500 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY). Follow us: Twitter – Facebook - LinkedIn |