Press Releases 109 to 114 of 1639
20.02.2024 11:40 Infineon places €500 million bond with a maturity of three years
Neubiberg – 20 February 2024 – Yesterday, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) successfully placed a corporate bond with a volume of €500 million under its EMTN (European Medium Term Notes) program. The placement was multiple times over-subscribed. The bond has an annual coupon of 3.375% and a maturity of three years.
15.02.2024 10:15 Infineon introduces lower cost Bluetooth® long-range module, CYW20822-P4TAI040, for low power applications
Munich – 15 February 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the CYW20822-P4TAI040, its latest Bluetooth® module that pushes the low-power and range boundaries for wireless connectivity in IoT and consumer electronics. This module is the most cost effective in its class, offers seamless integration, enhanced performance with Bluetooth low-energy long-range (LE-LR) support, and exceptional reliability for a wide range of applications. With the right combination of low power and high performance, Infineon’s CYW20822-P4TAI040 is designed to support the entire spectrum of Bluetooth LE-LR use cases including industrial IoT applications, smart home, asset tracking, beacons and sensors, and medical devices.
14.02.2024 11:25 Infineon drives decarbonization and digitalization with the broadest power solutions portfolio in the industry at APEC 2024
Munich, Germany, and San Jose, California – 14 February 2024 – Today, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global leader in power systems and IoT, detailed its plans to highlight the industry’s broadest range of power electronic devices during the 2024 Applied Power Electronics Conference (APEC), 25–29 February. Infineon’s wide-bandgap solutions offer the highest efficiency and power density, providing a key element to addressing climate change and accelerating decarbonization efforts. The Infineon best-in-class portfolio includes power devices for leading applications on silicon, silicon carbide (SiC) and gallium nitride (GaN) materials.
07.02.2024 14:30 Infineon and Worksport collaborate to reduce weight and cost of portable power stations with GaN
Munich, Germany and West Seneca, NY, USA – 7 February 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has announced a collaboration with Worksport Ltd. (Nasdaq: WKSP; WKSPW). Worksport will use Infineon’s GaN power semiconductors GS-065-060-5-B-A in the converters for its portable power stations to increase efficiency and power density. Enabled by Infineon’s GaN transistors, the power converters will be lighter and smaller in size with reduced system costs. In addition, Infineon will support Worksport in the optimization of circuits and layout design to further reduce size and increase power density.
06.02.2024 07:33 Infineon with robust Q1 FY 2024. Market environment outside automotive remains weak. Weaker currency and markets are leading to an adjustment of FY 2024 outlook
Neubiberg, 6 February 2024 – Today, Infineon Technologies AG is reporting results for the first quarter of the 2024 fiscal year (period ended 31 December 2023).
05.02.2024 14:15 Infineon and VMAX intensify collaboration for energy-efficient and cost-effective fast charging of electric vehicles
Munich, Germany – 5 February 2024 – VMAX, a leading Chinese manufacturer of power electronics and motor drives for new energy vehicles, has selected the new CoolSiC™ hybrid discrete with TRENCHSTOP™ 5 Fast-Switching IGBT and CoolSiC Schottky Diode from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) for its next generation 6.6 kW OBC/DCDC on-board chargers. Infineon’s components come in a D²PAK package and combine ultra-fast TRENCHSTOP 5 IGBTs with half-rated free-wheeling SiC Schottky barrier diodes to achieve a perfect cost-performance ratio for both hard and soft switching topologies. With their superior performance, optimized power density and leading quality, the power devices are ideally suited for VMAX’s on-board chargers.
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