Press Releases 1093 to 1098 of 1640
14.03.2013 14:45 Infineon Austria awarded the National Innovation Prize
Neubiberg and Villach, Austria, March 14, 2013 - Infineon Technologies AG has been honored with the 2013 National Innovation Prize in Austria. The company received the prize for the 300-millimeter thin wafer technology it developed at its site in Villach, Austria. ...
06.03.2013 10:00 Bundesdruckerei and Infineon Develop a Security Card with a One-Time Password and LED Display
Berlin / Neubiberg / Hanover, Germany - March 6, 2013 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Bundesdruckerei GmbH have developed a new security smart card with an LED display and a one-time password. This new technology is centred around a security chip in the card which generates a one-time password for each transaction and displays this on the integrated LED display. ...
28.02.2013 17:30 Supervisory Board extends contract of Dominik Asam
Neubiberg, Germany - February 28, 2013 - The Supervisory Board of Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has extended the contract of Chief Financial Officer Dominik Asam for five years until December 31, 2018. Dominik Asam was appointed as Chief Financial Officer to the Management Board...
28.02.2013 10:03 Annual General Meeting 2013 of Infineon Technologies AG in Munich/Germany
Infineon Annual General Meeting on February 28, 2013, 10.00 a.m. CET, ICM (Internationales Congress Center München), Munich/Germany ...
26.02.2013 09:30 Easy Switch from 8-bit to 32-bit with XMC1000 Industrial Microcontroller Family of Infineon; Samples and Tools Now Available
Neubiberg and Nuremberg, Germany - February 26, 2013 - At the Embedded World Exhibition & Conference 2013, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today presented samples of its new XMC1000 industrial 32-bit microcontroller family which provides system designers with strong incentive to switch from 8 to 32 bit MCU architecture. ...
19.02.2013 10:00 300-millimeter thin-wafer production by Infineon completes qualification; First CoolMOS™ family chips now being shipped worldwide
Neubiberg, Germany - February 19, 2013 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has achieved a major breakthrough in the manufacturing of power semiconductors on 300-millimeter thin wafers. In February, the company received the first customer go-aheads for products of the CoolMOS family produced by the 300-millimeter line at the Villach (Austria) site. ...
  «« « 181 182 183 184 185 » »»
 
 
 
» Infineon Technologies
» Press Releases
» News by E-mail
Subscribe to our press
newsletter service for free
» News by RSS-Feed
Subscribe to the RSS-Feed
without any registration
» Contact Agency
MEXPERTS AG
Tel.: +49 (0)8143 59744-00
www.mexperts.de