Press Releases 115 to 120 of 1639
01.02.2024 08:00 Infineon and Honda enter strategic collaboration and sign MoU to collaborate on automotive semiconductor solutions
Munich, Germany and Tokyo, Japan – 1 February 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that Infineon and Honda Motor Co., Ltd. have signed a Memorandum of Understanding (MoU) to build a strategic collaboration. Honda selects Infineon as semiconductor partner to align future product and technology roadmaps. The two companies also agreed to continue discussions on supply stability, as well as to encourage transferring mutual knowledge and collaborate on projects aimed at accelerating the time to market of technologies.
31.01.2024 14:15 Infineon teams with Framework to launch an upgradeable, customizable, repairable laptop with advanced USB-C connectivity
Munich, Germany and San Francisco, CA, USA – 31 January 2024 – The issue of e-waste and disposable laptops has become a growing concern for many consumers looking for more sustainable options for their technology products. In response, Framework Computer Inc., in collaboration with Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), has recently launched their latest product, the Framework Laptop 16. This laptop is the first consumer product to support 180 W and 240 W USB-C, thanks in large part to the use of the highly integrated dual/single port USB-C PD controller with Extended Power Range (EPR) support, EZ-PD™ CCG8.
30.01.2024 11:15 Infineon presents hybrid Time of Flight (hToF): Advanced technology for next-generation smart robots
Munich, 30 January 2024 – In collaboration with device manufacturer OMS and pmdtechnologies, an expert in Time of Flight (ToF) technology, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has developed a new high-resolution camera solution that enables enhanced depth sensing and 3D scene understanding for next-generation smart consumer robots. The new hybrid Time of Flight (hToF) solution combines two depth sensing concepts and helps significantly reduce maintenance effort and costs for smart robots.
30.01.2024 10:15 Infineon achieves ISO/SAE 21434 certification for SLI37 automotive security controllers
Munich, Germany – 30 January 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is the first company in the industry to receive the ISO/SAE 21434 cybersecurity certification for its SLI37 automotive security controller family. This enables a high level of security with ISO/SAE-compliant products and will facilitate customer integration into automotive applications such as secured devices for V2X (Vehicle-to-everything) communication. It follows the certification of Infineon’s cybersecurity management system, which was announced in November 2022.
25.01.2024 14:15 Infineon joins hands with Sinexcel to expand the energy storage market and promote the development of green energy
Munich, Germany, and Shenzhen, China – 25 January 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced a partnership with Shenzhen based Sinexcel Electric Co., Ltd., a global leader in core power equipment and solutions for the Energy Internet. Infineon will provide Sinexcel with its industry-leading 1200 V CoolSiC™ MOSFET power semiconductor devices in combination with EiceDRIVER™ compact 1200 V single-channel isolated gate drive ICs to further improve the efficiency of energy storage systems.
25.01.2024 11:45 Infineon’s latest acquisition GaN Systems receives “Graduate Of The Year” Award by the Cleantech Group
Munich, Germany and San Francisco, USA – 25 January 2024 – Acquired by Infineon Technologies (FSE: IFX / OTCQX: IFNNY) in October 2023, GaN Systems has been recognized as the “Graduate Of The Year” by The Global Cleantech 100. The announcement was made at Cleantech Forum North America in San Francisco.
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