| 04.05.2010 09:00 |
New .XT-technology from Infineon Significantly Increases Lifetime of IGBT Modules and Opens the Path for Higher Junction Temperature up to 200°C |
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Neubiberg - May 04, 2010 - Infineon Technologies today at PCIM Europe 2010 in Nuremberg (May 4-6, 2010) introduces an innovative IGBT internal packaging technology, which significantly increases the lifetime of IGBT modules. The new .XT technology optimizes all interconnections within an IGBT ... |
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| 03.05.2010 14:00 |
Infineon Technologies and Mitsubishi Electric Team Up to Serve the Global Power Electronics Industry |
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Neubiberg, Germany - May 3, 2010 - Infineon Technologies and Mitsubishi Electric Corporation agreed to establish a service agreement by which they will both serve the industrial motion controls and drives market worldwide as sources for the advanced IGBT module packages SmartPACKs and SmartPIMs. ... |
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| 03.05.2010 11:15 |
Infineon introduces new ThinPAK 8x8 leadless SMD package for HV Power MOSFETs designed to enable higher power density solutions |
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Neubiberg, Germany – May 3, 2010 – Infineon Technologies today introduces the ThinPAK 8x8, a new leadless SMD package for HV MOSFETs. The new package has a very small footprint of only 64mm² (vs. 150mm² for the D2PAK) and a very low profile with only 1mm height (vs. 4.4mm for the ... |
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| 28.04.2010 07:32 |
Infineon updates FY 2010 guidance: Revenue now forecast to grow by a high 30's percentage, with combined Segment Result margin of more than ten percent - Strong second quarter results with 10.6 percent Segment Result margin |
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Neubiberg, Germany - April 28, 2010 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today reported results for the second quarter of the 2010 fiscal year, ended March 31, 2010. ... |
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| 22.04.2010 11:00 |
Infineon Technologies and Fairchild Semiconductor Enter Into Compatibility Agreement for Power MOSFETs |
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Neubiberg, Germany - April 22, 2010 - Infineon Technologies and Fairchild Semiconductor today announced a packaging partnership for their power MOSFETs in the Infineon PowerStage 3x3 or Fairchild MLP 3x3 (Power33™) packages. ... |
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| 19.04.2010 11:30 |
Infineon Supplies Chip Solutions for Market-Viable, Affordable Electric Mobility |
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Neubiberg, Germany - April 19, 2010 - With oil reserves dwindling, energy prices escalating, the climate changing, and strict restrictions limiting vehicle emissions, industry players and policymakers agree that tomorrow’s cars will be electric-powered. However, a number of technical and infrastructor ... |
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