| 24.08.2010 11:15 |
Infineon Makes a Donation to Pakistan |
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Neubiberg, Germany - August 24, 2010 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has decided to make a donation of Euro 100,000 to Pakistan flood victims. "We are dismayed at the extent of this disaster of the century in Pakistan and feel obligated to help those in great need," says Peter ... |
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| 12.08.2010 19:00 |
IBM and Infineon divest joint venture Altis Semiconductor |
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Neubiberg, Germany - August 12, 2010 - In a joint effort to secure the future of Altis Semiconductor and its employees, IBM (NYSE:IBM) and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today closed a transaction to sell 100% of the share capital of Altis Semiconductor to the new corporation ... |
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| 06.08.2010 12:18 |
Infineon Announces Voluntary Filing for Deregistration with the U.S. Securities and Exchange Commission |
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Neubiberg, Germany - August 6, 2010 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has voluntarily filed a Form 15-F with the U.S. Securities and Exchange Commission to terminate the registration of Infineon’s ordinary shares under the U.S. Securities Exchange Act. ... |
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| 04.08.2010 14:45 |
Changes in the Management Board of Infineon Technologies AG |
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Neubiberg, Germany – August 4, 2010 – Peter Bauer, former Spokesperson of the Management Board, has been appointed Chairman of the Board with immediate effect.
Chief Financial Officer and Labor Director Dr. Marco Schröter has left the Management Board of Infineon Technologies AG with immediate effect... |
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| 02.08.2010 17:08 |
Infineon in discussions with interested parties for Wireless Solutions Segment |
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Neubiberg, August 2, 2010 - Infineon Technologies AG is in discussions with interested parties about a transaction concerning Infineon’s segment Wireless Solutions (WLS). A significant progress has been made within these discussions. ... |
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| 02.08.2010 11:00 |
Launch of Europe's Largest Research Project on Maximum Integration and Miniaturization of Microelectronic Systems for Automotive, Industrial and Communication Electronics |
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Neubiberg, Germany - August 2, 2010 - The biggest research project in Europe to research and develop highly integrated electronic system-in-package solutions has been launched. Working together on the ESiP project (Efficient Silicon Multi-Chip System-in-Package Integration) are 40 microelectronics ... |
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