Press Releases 1435 to 1440 of 1611
11.10.2007 09:45 Infineon Receives 2007 Microsoft Vendor Program Excellence Award
On October 5, 2007, Microsoft Corp. announced the winners of the 2007 Microsoft® Vendor Program (MSVP) Excellence Awards. Among the 15,000 vendors that Microsoft works with in the United States, Microsoft selected Infineon Technologies as one of this year's six winners. ...
09.10.2007 12:00 Infineon And Jungo Partner To Deliver Carrier-Grade Residential Gateway Platform
Neubiberg, Germany, and San Jose, CA October 09, 2007 - Infineon Technologies (FSE/NYSE: IFX) and Jungo Ltd., today announced a partnership to deliver production-ready, carrier-grade reference designs for the multi-service residential gateway market. The partnership enables customers to offer complete ...
09.10.2007 12:00 Infineon’s AMAZON-SE ADSL2/ 2+ System-On-a-Chip Wins IEC 2007 InfoVision Award in “Enabling Silicon and Component-Level Technologies” Category
Berlin, Germany, October 9, 2007 - Today, at the Broadband World Forum (BBWF) in Berlin, Infineon Technologies (FSE/NYSE: IFX) received an InfoVision Award from the International Engineering Consortium (IEC). Infineon’s integrated AMAZON-SE ADSL2/ 2+ system-on-a-chip (SoC) was selected as ...
08.10.2007 09:30 DareGlobal Selects Infineon's AMAZON-SE ADSL2/ 2+ System-on-a-Chip
Neubiberg, Germany, October 8, 2007  - Infineon Technologies AG (FSE/NYSE: IFX) a leading supplier of communication ICs, today announced that DareGlobal Technologies Co., Ltd. has selected the Infineon AMAZON-SE System-on-a-Chip (SoC) for its modem/router solutions. ...
02.10.2007 10:30 Infineon and Hosiden Cooperate on Silicon Microphone Activities
Neubiberg, Germany and Osaka, Japan - October 2nd, 2007 - Infineon Technologies AG (FSE, NYSE: IFX) and Hosiden Corporation (TSE, OSE: Hosiden), one of the world’s leading microphone manufacturers, today announced a cooperation on Silicon Microphones activities. Infineon contributes its semiconductor expertise and MEMS...
26.09.2007 15:00 International Rectifier Grants License Agreement for DirectFET® Packaging Technology to Infineon Technologies
Neubiberg, Germany and El Segundo, California - September 26, 2007 - Infineon Technologies (FSE/NYSE: IFX) and International Rectifier, IR® (NYSE: IRF) today announced that Infineon will license from International Rectifier its patented advanced power management packaging technology, DirectFET®...
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