| Press Releases 157 to 162 of 1639 |
 |
| 24.10.2023 17:50 |
Infineon completes acquisition of GaN Systems, becoming a leading GaN power house |
|
Munich, Germany, and Ottawa, Canada – 24 October 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the closing of the acquisition of GaN Systems Inc. (“GaN Systems”). The Ottawa-based company brings with it a broad portfolio of gallium nitride (GaN)-based power conversion solutions and leading-edge application know-how. All required regulatory clearances have been obtained and GaN Systems has become part of Infineon effective as of the closing. |
|
|
| 24.10.2023 11:00 |
Infineon to pilot new AI developer model by Archetype AI to enhance AI sensor solution innovation |
|
Munich, Germany – 24 October 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global semiconductor manufacturer and leader in power systems and IoT, and Archetype AI, Inc., a pioneer in AI for the physical world, today announced that they have signed a strategic partnership to accelerate the future development of sensor-based chips with AI functionalities that will make life easier, safer and greener. |
|
|
| 23.10.2023 14:15 |
TRAVEO™ T2G Cluster graphics MCU family delivering MPU like performance at MCU cost for automotive graphic applications |
|
Munich, Germany – 23 October, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced its new TRAVEO™ T2G Cluster family of automotive microcontrollers (MCU) with a new graphic engine. The engine features a new smart rendering technology and delivers outstanding performance for automotive graphics applications. With a small footprint, the new MCUs simplify OEM integration and reduce BOM costs, making them an ideal solution for advanced smart mobility instrument cluster and heads-up display systems for automobiles, motorcycles, and off highway mobility as well as for industrial and medical applications where quality and safety are important. |
|
|
| 23.10.2023 10:25 |
Infineon opens laboratory for quantum electronics and Power AI |
|
Infineon Technologies AG has opened a new laboratory for the development of quantum electronics in Oberhaching near Munich. The objective is to develop and test microelectronic circuits for quantum computers which will be stable and small, will operate reliably and which can be produced on an industrial scale. Approximately twenty researchers will work at the lab. In addition to quantum computing, activities will also focus on the development of AI algorithms for the early detection of variances in power systems. |
|
|
| 20.10.2023 14:45 |
STIWA presents smart lock solution SMALOX based on Infineon's battery-less NFC lock technology at the Parcel and Post Fair in Amsterdam |
|
Munich, Germany and Attnang-Puchheim, Austria – 20 October, 2023 – STIWA Group, a leader in automation and manufacturing technology, will present its smart lock solution SMALOX at the Parcel and Post Fair in Amsterdam, Netherlands. The smart lock is designed to meet the diverse needs and challenges of the rapidly evolving parcel and postal services market. It offers a versatile and innovative solution for various applications, including home boxes, click and collect boxes, and key boxes. SMALOX makes use of the near field communication (NFC) technology developed by Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY). |
|
|
| 19.10.2023 15:15 |
Infineon joins the EMVCo Board of Advisors to advance mission of increasing trust and consumer convenience in the payment space |
|
Munich, Germany – 19 October, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has joined the EMVCo Board of Advisors to leverage its decades of experience in the space of semiconductor security and connectivity to improve global trust and convenience in card payments. EMVCo, a global technical body, creates and manages EMV specifications and programs that enable seamless and secure card-based payments for businesses and consumers worldwide. The organization is responsible for authentication specifications and security technologies such as EMV® Chip Contact, EMV 3-D Secure (3DS), and more. |
|
|
| |
««
«
25
26
27
28
29
»
»»
|
|
|
|
|
|
