| Press Releases 193 to 198 of 1639 |
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| 12.07.2023 14:15 |
Partnership reinforced: Infineon and Semikron Danfoss sign supply agreement for electromobility chips |
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Munich and Flensburg, Germany – 12 July, 2023 – Cars with fully or partially electrified drivetrains will account for two thirds of cars produced by 2028, as per analyst forecasts. This rapid growth of electromobility is driving the demand for power semiconductors. Against this background, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Semikron Danfoss have signed a multi-year volume agreement for the supply of silicon-based electromobility chips. Infineon will supply chipsets consisting of IGBTs and diodes to Semikron Danfoss. These chips are mainly used in power modules for inverters, which are used for the main drive in electric vehicles. |
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| 07.07.2023 10:15 |
Infineon further extends its edge AI capabilities and choice-of-platforms for Machine Learning-based models for Bluetooth customers by partnering with Edge Impulse |
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Munich, Germany – 7 July, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced it is teaming with Edge Impulse to extend its Tiny Machine Learning-based AI development tools for the PSoC™ 63 Bluetooth® LE microcontroller (MCU). Developers of AI-enabled IoT applications can now also build edge Machine Learning (ML) applications using the Edge Impulse Studio environment for deployment on high-performance, low-power PSoC 63 Bluetooth LE MCUs. |
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| 06.07.2023 11:15 |
Teledyne e2v and Infineon partner on optimized processor boot solution for high reliability edge computing space systems |
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Munich, Germany, and Grenoble, France – 6 July, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Teledyne e2v (NYSE:TDY) have developed a reference design for the implementation of compute-intensive space systems. The design, built around a Teledyne e2v QLS1046-Space edge computing module, which is configured by the radiation-hardened 64MByte Infineon SONOS based NOR Flash memory, enables high performance space processing applications. The reference design addresses two inherent challenges in space endeavors: weight and communication limitations. By reducing the number of components in the computing system and enabling AI computation at the edge, it helps to decrease latency and overcome communication restrictions. |
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| 30.06.2023 10:15 |
Infineon and Kontrol join forces to improve the safety of autonomous vehicles |
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Munich, Germany, and Linz, Austria – 30 June, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and the Austrian product compliance company Kontrol are entering into a strategic partnership to make the future of mobility as both legally compliant and safe as possible. In the field of autonomous driving, legal requirements, standards, norms, and court rulings still pose major challenges for all market players. For authorities and vehicle registration services, the challenge is to find a safe and cost-efficient approach to autonomous driving licensing in public transport, typically in the form of laws and technologies. |
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| 29.06.2023 12:00 |
STIHL honors Infineon as "Supplier of the Year 2022" in the semiconductor sector |
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Munich, Germany – June 29, 2023 — World chainsaw market leader STIHL honors Infineon Technologies AG as "Supplier of the Year 2022" for being a highly reliable partner in terms of quality and delivery capability, even in a challenging environment. Infineon not only supports STIHL's battery strategy as a main supplier in the semiconductor segment, but also collaborates closely with STIHL in the area of research and development. The collaboration is to generate innovations in the field of energy-efficient motor control for battery-powered tools using compound semiconductors based on gallium nitride (GaN). |
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| 28.06.2023 14:15 |
New automotive-qualified XENSIV™ MEMS microphone with analog interface for audio and active noise cancelation systems |
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Munich, Germany – 28 June, 2023 – Active Noise Cancellation (ANC) ensures a quiet vehicle interior and provides passengers with a more relaxed driving experience. Furthermore, using advanced ANC solutions instead of passive damping methods significantly reduces the vehicle weight, which benefits vehicle efficiency. For ANC systems with an analog interface, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is now expanding its automotive microphone portfolio with the XENSIV™ MEMS microphone IM68A130A with a flat frequency response to frequencies below 10Hz. It builds on the successful launch of Infineon’s first automotive-qualified digital MEMS microphone, the IM67D130A, and combines the company’s automotive expertise with its technical know-how in high-end MEMS microphones. |
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