Press Releases 217 to 222 of 1639
05.05.2023 14:15 Infineon launches CoolGaN™ 600 V GIT HEMT portfolio, delivering exceptional performance and quality, in full supply
Munich, Germany – 5 May, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has successfully integrated the CoolGaN™ 600 V hybrid-drain-embedded gate injection transistor (HD-GIT) technology into its in-house manufacturing. The company is now releasing the complete portfolio of its high-quality GaN devices to the broader market. Taking advantage of Infineon’s fully owned and controlled supply chain, the expanded GaN portfolio includes a wide range of discrete and fully integrated GaN devices that far exceed JEDEC lifetime requirements. The new CoolGaN devices have been optimized for various applications ranging from industrial SMPS for servers, telecom, and solar to consumer applications, such as chargers and adapters, motor drives, TV/monitor, and led lighting systems.
05.05.2023 10:15 New OptiMOS™ 7 40V MOSFET family for automotive applications improves on-state resistance, switching efficiency as well as design robustness
Munich, Germany – 5 May, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the OptiMOS™ 7 40V MOSFET family, its latest generation of power MOSFETs for automotive applications in a variety of lead-free and robust power packages. The new family combines 300 mm thin-wafer technology with innovative packaging to deliver significant performance benefits in tiny packages. This makes the MOSFETs ideal for all standard and future automotive 40V MOSFET applications, such as electric power steering, braking systems, disconnect switches new zone architectures. OptiMOS 7 is also aiming at battery management, e-fuse boxes as well as DC-DC and BLDC drives in a wide range of variants.
04.05.2023 16:15 Infineon’s highly integrated new wireless power transmitter IC is ideal for charging applications up to 50 W
Munich, Germany – 4 May, 2023 – Wireless charging has become an integral part of the modern battery-powered world, providing a streamlined and user-friendly experience for portable products across a wide range of industries. With the WLC1150 wireless charging transmitter IC, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its portfolio of wireless charging (WLC) controller ICs, offering a highly integrated, easy-to-design, and cost-effective solution for applications requiring higher wireless power transfer. These include industrial applications, healthcare equipment, robotics and drones, vacuum cleaners, power tools, docking stations, and smartphone chargers supporting Qi Extended Power Profile (EPP).
04.05.2023 07:32 Infineon concludes a significantly better-than-expected quarter and again raises its outlook for the current fiscal year
Neubiberg, 4 May 2023 – Today, Infineon Technologies AG is reporting results for the second quarter of its 2023 fiscal year (period ended 31 March 2023).
03.05.2023 09:00 Infineon announces supplier agreement on wafers and boules with Chinese silicon carbide supplier TanKeBlue to diversify its supply base even further
Munich, Germany – 3 May 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is diversifying its silicon carbide (SiC) supplier base and has signed a long-term agreement with Chinese SiC supplier TanKeBlue to secure additional competitive SiC sources. TanKeBlue will supply the Germany-based semiconductor manufacturer with competitive and high-quality 150-millimeter SiC wafers and boules for the manufacturing of SiC semiconductors, covering a double-digit share of the forecasted demand in the long term.
03.05.2023 09:00 Infineon further diversifies its silicon carbide supplier base; new supplier agreement with SICC on wafers and boules
Munich, Germany – 3 May, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has signed an agreement with Chinese silicon carbide (SiC) supplier SICC to diversify Infineon's SiC material supplier base and to secure additional competitive SiC sources. Under the agreement, SICC will supply the Germany-based semiconductor manufacturer with competitive and high-quality 150-millimeter wafers and boules for the manufacturing of SiC semiconductors, covering a double-digit share of the forecasted demand in the long term.
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