Press Releases 229 to 234 of 1639
26.04.2023 10:15 Infineon and SCHWEIZER extend cooperation in chip embedding to develop more efficient silicon carbide automotive solutions
Munich and Schramberg, Germany – 26 April, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Schweizer Electronic AG (ETR: SCE) are collaborating on an innovative way to further increase the efficiency of chips based on silicon carbide (SiC). Both partners are developing a solution to embed Infineon’s 1200 V CoolSiC™ chips directly onto printed circuit boards (PCB). This will increase the range of electric vehicles and reduce the total system costs.
20.04.2023 10:15 Infineon enables next-generation automotive E/E architectures with industry’s first LPDDR Flash memory
Munich, Germany – 20 April, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today launched the industry’s first LPDDR Flash memory to enable next-generation automotive E/E architectures. The Infineon SEMPER™ X1 LPDDR Flash offers safe, reliable and real-time code execution critical for automotive domain and zone controllers. The device delivers 8 times the performance of current NOR Flash memories and achieves 20 times faster random read transactions for real-time applications. This enables software-defined vehicles to deliver advanced features with enhanced safety and architectural flexibility.
19.04.2023 11:45 Infineon drives decarbonization and digitalization for a greener future with innovative semiconductor solutions at PCIM Europe 2023
Munich, Germany – 19 April, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) offers power solutions such as CoolSiC™ and CoolGaN™ that enable higher energy efficiency. This makes them key to sustainable designs and an important building block for the energy transition. At PCIM Europe 2023, Infineon will showcase how its latest solutions in power semiconductors and wide bandgap technologies provide answers to the current challenges of green and digital transformation. Under the motto “Driving decarbonization and digitalization. Together.”, the company will offer numerous demonstrations, live TechTalks, and the opportunity to discuss design challenges with experts. Alternatively, industry professionals can register for the Infineon's virtual platform, which will be available around the clock from 27 April onwards.
18.04.2023 15:15 PROFET™ Load Guard 12V is powering up automotive ADAS and power distribution with adjustable overcurrent limitation and capacitive load switching mode
Munich, Germany – 18 April, 2023 – Today, almost every new car is equipped with advanced driver assistance systems (ADAS), and the automotive industry is striving for even higher automation. Such safety-critical systems require a dependable and intelligent board net architecture and, in combination with more comfort functionalities, lead to an increasing number of loads. The E/E-architecture therefore requires reliable and intelligent solutions that protect sensitive loads from overcurrent events and ensure fast fault isolation towards the power distribution system.
14.04.2023 10:00 Hi-Lo Systems supports Infineon’s OPTIGA™ TPM firmware programming to accelerate device manufacturers’ time-to-market
Munich, Germany, and Taipei, Taiwan – 14 April, 2023 – Infineon Technologies (FSE: IFX / OTCQX: IFNNY) and Hi-Lo Systems, a Taiwan based IC programming and testing company, today announced their partnership in the area of Trusted Platform Module (TPM) security chips. Hi-Lo Systems has officially become an Associated Partner of Infineon in the Greater China market and will provide firmware update programming services for Infineon’s OPTIGA™ TPMs. This will help accelerate time-to-market for a wide range of device manufacturers.
03.04.2023 09:00 Infineon streamlines its decarbonization profile: Division for industrial applications to operate under the name Green Industrial Power (GIP)
Munich, Germany – 3 April 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has changed the name of its Industrial Power Control (IPC) Division to Green Industrial Power (GIP). The semiconductor manufacturer is thus highlighting its consistent alignment with the Decarbonization and Digitalization trends. For the newly named Division, green energies are key growth drivers for the business.
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