Press Releases 25 to 30 of 1628
10.09.2024 11:15 Infineon announces StrongIRFET™ 2 power MOSFET 30 V portfolio for mass market applications
Munich, Germany – 10 September 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is introduced its new StrongIRFET™ 2 power MOSFET 30 V portfolio, expanding the existing StrongIRFET 2 family to address the growing demand for 30 V solutions in the mass market segment. Optimized for high robustness and ease-of-use, the new power MOSFETs were specifically designed to meet the requirements of a wide range of mass market applications, enabling high design flexibility. Amongst these applications are industrial switched-mode power supplies (SMPS), motor drives, battery-powered applications, battery management systems, and uninterruptible power supplies (UPS).
05.09.2024 15:45 Roborock uses hybrid Time-of-Flight system by Infineon and pmdtechnologies for sweeping and mopping robots
Munich, Germany – 5 September 2024 – Roborock, a global leader in intelligent home robotics, has launched the intelligent sweeping and mopping all-in-one robot Roborock Qrevo Slim at IFA 2024 in Berlin, equipped with an innovative 3D camera module for navigation and obstacle avoidance using the REAL3™ Time-of-Flight (ToF) imager by Infineon Technologies (FSE: IFX / OTCQX: IFNNY). The technology allows to reduce size and increase reliability. Compared to the body height of traditional sweeping and mopping robots of around 100 mm, the overall height of the Roborock Qrevo Slim is only 82 mm, allowing it to pass through lower and narrower spaces while providing high reliability.
13.08.2024 11:15 Infineon expands its Bluetooth® portfolio with eight new parts, including the AIROC™ CYW89829 Bluetooth LE MCU for automotive applications
Munich, Germany – 13 August 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the expansion of its Bluetooth® portfolio by eight new products in the AIROC™ CYW20829 Bluetooth Low Energy 5.4 microcontroller (MCU) family, featuring Systems-on-Chip (SoCs) and modules optimized for industrial, consumer, and automotive use cases. The high integration of the CYW20829 product family allows designers to reduce bill-of-material (BOM) cost and device footprint in a wide variety of applications, including PC accessories, low-energy audio, wearables, solar micro inverters, asset trackers, health and lifestyle, home automation and others. Product designers also benefit from Infineon’s rich development infrastructure and commitment to robust security, with support for secure boot and execution environments and cryptography acceleration to safeguard sensitive data.
12.08.2024 10:15 Infineon presents high-performance CIPOS™ Maxi Intelligent Power Modules for industrial motor drives of up to 4 kW
Munich, Germany – 12 August 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its 7th generation TRENCHSTOP™ IGBT7 product family with the CIPOS™ Maxi Intelligent Power Module (IPM) series for low-power motor drives. The new IM12BxxxC1 series is based on the new TRENCHSTOP IGBT7 1200 V and rapid diode EmCon 7 technology. Thanks to the latest micro-pattern trench design, it offers exceptional control and performance. This results in significant loss reduction, increased efficiency, and higher power density. The portfolio includes three new products in variants ranging from 10 A to 20 A for power ratings of up to 4.0 kW: IM12B10CC1, IM12B15CC1 and IM12B20EC1.
09.08.2024 10:15 Highest power density for DCDC converters demonstrated by Vitesco Technologies using Infineon’s CoolGaN™ Transistors
Munich, Germany – 9 August 2024 – DCDC converters are essential in any electric or hybrid vehicle to connect the high-voltage battery to the low-voltage auxiliary circuits. This includes 12 V power headlights, interior lights, wiper and window motors, fans, and at 48 V, pumps, steering drives, lighting systems, electrical heaters, and air conditioning compressors. In addition, the DCDC converter is important for developing more affordable and energy-efficient vehicles with an increasing number of low voltage functions. According to TechInsights, the global automotive DC-DC converter market size was valued at USD 4 billion in 2023 and is projected to grow to USD 11 billion by 2030, exhibiting a CAGR of 15 percent during the forecast period. Gallium nitride (GaN) in particular plays a crucial role here, as it can be used to improve the power density in DCDC converters and on-board chargers (OBC). For this reason, Vitesco Technologies, a leading supplier of modern drive technologies and electrification solutions, has selected GaN to improve the power efficiency of its Gen5+ GaN Air DCDC converter. The CoolGaN™ Transistors 650 V from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) significantly improve the overall system performance while minimizing system cost and increasing ease of use. As a result, Vitesco created a new generation of DCDC converters that set new standards in power density (efficiency of over 96 percent) and sustainability for power grids, power supplies, and OBCs.
08.08.2024 06:52 Infineon opens the world’s largest and most efficient SiC power semiconductor fab in Malaysia
Kulim, Malaysia – 8 August 2024 – As global decarbonization efforts drive demand for power semiconductors, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY)  has officially opened the first phase of a new fab in Malaysia that will become the world’s largest and most competitive 200-millimeter silicon carbide (SiC) power semiconductor fab. Malaysian Prime Minister YAB Dato’ Seri Anwar Ibrahim and Chief Minister of the state of Kedah YAB Dato’ Seri Haji Muhammad Sanusi Haji Mohd Nor joined Infineon CEO Jochen Hanebeck, to symbolically launch production.
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