| Press Releases 259 to 264 of 1696 |
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| 20.06.2023 11:15 |
Infineon’s XENSIV™ PAS CO2 meets the performance criteria of internationally recognized WELL and LEED green building standards |
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Munich, Germany – 20 June, 2023 – As part of the global effort for decarbonization, improving the energy efficiency of buildings is a critical part of the solution. To help address this requirement, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) provides the XENSIV™ PAS CO2 sensor for greener buildings. Today, Infineon announces its XENSIV PAS CO2 has passed the performance requirements defined by the internationally recognized green building certifications WELL and LEED. Specifically, the sensor contributes to 5 WELL features (e.g. ventilation design, air quality monitoring and awareness), and 6 LEED credits (e.g. optimized energy performance and enhanced indoor air quality strategies). These contributions enable buildings that pursue a certification to earn a maximum of 28 points for LEED and up to six points for WELL. |
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| 15.06.2023 13:45 |
New ISOFACE™ portfolio of digital isolators offers robust high-voltage isolation, best-in-class efficiency and noise immunity |
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Munich, Germany – 15 June, 2023 – Digital isolators have become the preferred choice in many modern designs because of the many benefits they offer. These include an optimized system bill of materials (BOM) and reduced printed circuit board (PCB) area, as well as accurate timing characteristics with lower power consumption. They also offer improved common-mode transient immunity (CMTI), certified insulation life, integrated features and output enable options. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces its first generation of ISOFACE™ dual-channel digital isolators to meet the growing demand for robust high-voltage isolation. The new devices are pin-to-pin compatible with other suppliers’ portfolios. |
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| 13.06.2023 10:15 |
Next generation 1200 V CoolSiC™ Trench MOSFET in TO263-7 package boosts e-Mobility |
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Munich, Germany – 13 June, 2023 – Infineon presents its new generation of 1200 V CoolSiC™ MOSFETs in TO263-7 for automotive applications. The automotive-graded silicon carbide (SiC) MOSFET generation offers high power density and efficiency, enables bi-directional charging and significantly reduces system cost in on-board charging (OBC) and DC-DC applications. |
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| 12.06.2023 10:15 |
Infineon releases new, enhanced features and capabilities to accelerate embedded development in ModusToolbox™ 3.1 |
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Munich, Germany – 12 June, 2023 – As software becomes a critical feature in the variety of embedded solutions in today’s products, embedded developers must have the right software tools to bring these products to market. This includes development tools that provide flexibility and the best platform with features and capabilities that extend from the “getting started” phase to the deployment on final hardware. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the release of ModusToolbox™ 3.1 with enhanced capabilities giving developers more features at their fingertips to develop software solutions for their hardware designs. |
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| 07.06.2023 12:15 |
Infineon’s HYPERRAM™ 3.0 memory and Autotalks’ 3rd generation chipset drive next-generation automotive V2X applications |
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Munich, Germany – 07 June, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Autotalks announced today that the two companies are collaborating to deliver solutions for next-generation V2X (Vehicle-to-Everything communication) applications. In this collaboration, Infineon provides its automotive-grade HYPERRAM™ 3.0 memory to support Autotalks’ TEKTON3 and SECTON3 V2X reference designs. |
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| 31.05.2023 15:45 |
AURIX™ embedded software: Enhanced MC-ISAR TC3xx MCAL adds ASIL D and SIL-2 compliant drivers to support AUTOSARv4.4.0 |
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Munich, Germany – 31 May, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) extends its AURIX™ TC3xx MCAL by adding support for AUTOSARv4.4.0 to the existing AUTOSARv4.2.2 MCAL. This facilitates software development for OEMs. For ASIL D applications, the MC-ISAR TC3xx roadmap has been updated to also provide ASIL D compliant drivers. With the upcoming Maintenance Release 2.25.0, the driver will include ASIL D compliant software products. Support for IEC 61508 SIL-2 will be provided with Release 2.30.0. The latest release aims at AUTOSAR applications in all automotive domains, including engine, chassis, safety, and body, but also commercial agricultural vehicles (CAV), industrial as well as marine applications. |
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