| Press Releases 259 to 264 of 1639 |
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| 20.02.2023 18:35 |
New ecosystem partners for AIROC™ CYW5459X portfolio to accelerate design cycle of robust, seamless connection for video and AI edge devices and IoT |
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Munich, Germany – February 20, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced it has added five new platform and module partners to support its proven high performance AIROC™ CYW5459x Wi-Fi and Bluetooth® combo portfolio. Additional partners include module partners AzureWave, Murata Electronics, Quectel Wireless and platform partners NVIDIA and Rockchip Electronics Co. With these new partners, end customers can accelerate development cycle and shorten time-to-market for their end products. |
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| 17.02.2023 13:00 |
Infineon’s latest SLC38 security device and TrustSEC’s operating system BIO-SLCOS provide secured, open platform for advanced smart card applications |
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Munich, Germany – 17 February, 2023 – In cooperation with Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), TrustSEC, a leader in information security and smart cards, has launched its new advanced smart cards operating system (OS) BIO-SLCOS. The OS uses Infineon's latest high-performance SLC38 Secure Element to provide a secured and open platform that combines the best in security, flexibility, and hardware independence to meet the comfort, performance and security requirements of the global smart card market. The solution is ideally suited for government identification, payment, ticketing and access applications, as well as for application providers looking to enhance their biometric solution in terms of security, performance and functionality. |
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| 17.02.2023 11:10 |
“Driving decarbonization and digitalization. Together.”: At MWC 2023 Infineon is showcasing its latest semiconductor technologies for a comfier and greener IoT |
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Munich, Germany – 17 February, 2023 – IoT technologies have the potential to overcome many of the challenges society faces today. Even more, they improve the quality of life, convenience and increase industrial productivity. At the heart of every IoT solution are microelectronics such as sensors, actuators, microcontrollers, connectivity modules and security components. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) offers all of them and will present these building blocks, complemented by various services, software, and tools, to visitors at Mobile World Congress 2023 in Barcelona, from February 27 to March 2. As a leading semiconductor manufacturer for power systems and IoT solutions, Infineon is working with customers and partners to jointly drive decarbonization and digitalization. |
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| 16.02.2023 18:30 |
Infineon Virtual Annual General Meeting approves dividend of €0.32 per share – Changes to the Supervisory board: Dr. Herbert Diess and Klaus Helmrich succeed Dr. Wolfgang Eder and Hans-Ulrich Holdenried, Dr. Herbert Diess becomes Chairman of the Supervisory Board |
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Munich, Germany – 16 February 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has finished its 23rd Annual General Meeting. The entire event was held in a virtual format and broadcast publicly on the company web site. Shareholders had the opportunity to speak live during the event and ask questions. |
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| 16.02.2023 11:00 |
German President Steinmeier visits Infineon site in Kulim, Malaysia; New exhaust air purification system will significantly improve Infineon's positive climate footprint |
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Munich, Kulim, 16 February 2023 - German President Frank-Walter Steinmeier visited Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) in Kulim, Malaysia, as part of his trip to Asia. The visit focused on Infineon's contribution to enabling the global energy transition with energy-saving semiconductor solutions, as well as by investing in solutions that further reduce the CO2 footprint in its chip manufacturing. |
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| 16.02.2023 09:00 |
Infineon kicks off new Fab in Dresden; Completion planned for 2026; Smart Power Fab will generate 1,000 new jobs |
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Munich, Germany – 16 February, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is starting construction of its new plant for analog/mixed-signal technologies and power semiconductors. After extensive analysis, the Infineon Management Board and supervisory bodies gave the green light for the Dresden site. The German Federal Ministry for Economic Affairs and Climate Action (BMWK) has approved an early project launch, meaning that construction can already begin before completion of the inspection of legal subsidy aspects by the European Commission. Subject to the European Commission's state aid decision and the national grant procedure, the project is to be funded in accordance with the objectives of the European Chips Act. Infineon is seeking public funding of around one billion euros. The company plans to invest a total of approximately five billion euros in the plant, which is set to begin production in 2026. This constitutes the largest single investment in the company's history. |
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