| Press Releases 283 to 288 of 1639 |
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| 15.12.2022 16:10 |
Infineon adds PQFN Dual-Side Cooling 25-150 V portfolio to its OptiMOS™ Source-Down power MOSFET family |
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Munich, Germany – 15 December, 2022 – The design of future power electronic systems is continuously pushed to improve state-of-the-art performance and power density. Supporting this trend, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches a new Source-Down 3.3 x 3.3 mm² PQFN product family in the 25-150 V classes with Bottom-Side (BSC) and Dual-Side Cooling (DSC) variants. The new product family provides significant enhancements on the component level to offer attractive solutions in DC-DC power conversion, opening up new possibilities for system innovation in server, telecom, OR-ing, battery protection, power tools, and charger applications. |
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| 12.12.2022 13:45 |
MathWorks Simulink products now support Infineon’s latest AURIX™ TC4x family of automotive microcontrollers |
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Munich, Germany and Natick, MA – 12 December 2022 – MathWorks and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced a hardware support package for the MathWorks Simulink® products for Infineon’s latest AURIX™ TC4x family of automotive microcontrollers. Automotive engineers designing advanced electric vehicles, sensor fusion, and radar signal processing functions can use the hardware support package, even before silicon is available. With the package, they can validate use cases, rapidly and automatically generate the embedded software, and test algorithms. |
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| 12.12.2022 11:00 |
Infineon again listed in Dow Jones Sustainability Index |
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Munich, 12 December 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is one of the most sustainable publicly listed companies worldwide for the 13th consecutive year. As announced by S&P Global, Infineon has once again been included in the Dow Jones Sustainability™ World Index and in the Dow Jones Sustainability™ Europe Index. |
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| 07.12.2022 11:15 |
Infineon named CES 2023 “Innovation Awards Honoree” for three different products: EXCELON™ F-RAM, XENSIV™ CSK and Smart Alarm System |
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Munich, Germany – 7 December, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has been named a CES® 2023 “Innovation Awards Honoree” for three products including its EXCELON™ F-RAM, XENSIV™ Connected Sensor Kit (CSK) and Smart Alarm System (SAS) for smart homes. This year’s program received a record high number of over 2,100 submissions. The announcement was made ahead of CES 2023, the world’s most influential technology event, happening 5-8 January in Las Vegas, Nevada. |
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| 01.12.2022 10:15 |
i-ToF imager based on Infineon’s novel pixel technology boosts 3D camera system performance at optimized cost |
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Munich, Germany – 1 December, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) in cooperation with 3D Time-of-Flight specialist and premium partner pmdtechnologies is introducing the IRS2975C imager sensor, a performance-push evolution of the IRS2875C. The imager works according to the Time-of-Flight (ToF) principle known as indirect ToF (i-ToF) and is the first in the industry based on Infineon’s latest advancements in pixel technology. Both form factor and the performance of the IRS2975C are tailored to the growing spot iToF applications, delivering highest possible operating range at optimal power budget. The new i-ToF imager is ideal for consumer use cases in smartphones, service robots, drones as well as various IoT devices. |
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| 29.11.2022 10:30 |
Infineon launches SLC26P security controller based on 28 nm technology for payment applications; expands its supply option to enable long-term, dependable sourcing for smart card and embedded security ICs |
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Munich, Germany – 29 November, 2022 – Commercial production of integrated circuits using 28 nm technology node began several years ago. As the process technology has matured, market demand for 28 nm products has also increased. Although offering numerous advantages, security applications have not been among the main applications of this technology, thus far. Today, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is introducing SLC26P, the first security IC targeting high volume payment applications based on the future-proof 28 nm technology node. |
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