| 28.11.2022 10:00 |
German Federal Printing Office, Fraunhofer and Infineon demonstrate for the first time electronic passport security for the quantum computer era |
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Munich – 28 November 2022 – Quantum computers could become a serious threat to the security of documents such as electronic passports before the present decade is over. New, quantum-secure encryption methods help protect stored biometric data. At Trustech, the event for innovative payment and identification solutions, Infineon Technologies AG, the German Federal Printing Office (Bundesdruckerei GmbH) and the Fraunhofer Institute for Applied and Integrated Security (AISEC) are presenting the world's first demonstrator for an electronic passport that meets the security requirements of the quantum computing era (Post Quantum Cryptography or PQC). |
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| 25.11.2022 13:15 |
Infineon and TSMC to introduce RRAM technology for automotive AURIX™ TC4x product family |
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Munich, Germany – 25 November, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and TSMC today announced the companies are preparing to introduce TSMC’s Resistive RAM (RRAM) Non-Volatile Memory (NVM) technology into Infineon’s next generation AURIX™ microcontrollers (MCU). |
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| 24.11.2022 10:15 |
Infineon and Fingerprints step into cooperation on the all-in-one solution SECORA™ Pay Bio that will bring biometric payment card to a new level |
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Infineon and Fingerprints step into cooperation on the all-in-one solution SECORA™ Pay Bio that will bring biometric payment cards to a new level
Munich, Germany and Gothenburg, Sweden – 24 November, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Fingerprint Cards AB
(STO: FING B, Fingerprints™) today announced the signing of a joint development and commercialization agreement of a plug-and-play turnkey solution for biometric payment smart cards. The goal of the cooperation is to make biometric smart card production as simple and easy as producing a standard dual interface payment card. |
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| 23.11.2022 11:15 |
EasyPACK™4B enables single module solution for the world’s largest 352 kW photovoltaic string inverter |
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Munich, Germany – 23 November, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) recently added EasyPACK™ 4B to its industry-leading Easy power module family. The lead-type of the new family targets applications in photovoltaic string inverters. In this application it can achieve up to 352 kW and allows a significant increase in output power of about 40 percent compared to last generation PV inverter of 250 kW using EasyPACK 3B. The module aims to enable a simpler but more powerful inverter design with higher power density and reduced system costs. The device is ideal for 1500 VDC solar string inverters. |
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| 21.11.2022 10:15 |
Infineon achieves ISO/SAE 21434 process certification; AURIX™ TC4xx microcontroller family first to be standard-certified |
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Munich, Germany – 21 November, 2022 – Introduced by the United Nations Economic Commission for Europe (UNECE), the new UN R155 regulation addresses the increasing focus on cybersecurity in connected automobiles. This regulation, which came into effect from July 2022, requires vehicle manufacturers to apply a security-by-design approach to their products and processes. To enable new vehicle sales in markets covered by the R155 regulation, the vehicle manufacturer must own a valid certificate of compliance for the cybersecurity management system (CSMS) applied to each vehicle type. To achieve certification, vehicle OEMs must implement cybersecurity practices across the supply chain to reduce the overall risk of attack throughout the vehicle lifecycle – from initial concept to end-of-life. |
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| 17.11.2022 11:15 |
Infineon`s new family of 2 x 37 W audio amplifiers features second generation of MERUS™ multilevel switching amplifier technology |
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Munich, Germany – 17 November, 2022 – When designing portable and battery-powered audio devices for consumer speaker applications, maximizing battery playback time and, at the same time, maintaining excellent audio performance in a compact form and at a low system cost is essential. MERUS™ multilevel switching technology from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is designed to achieve low switching losses and highly efficient amplification at both low and high output power, bringing the desired benefits in such applications. The new ICs feature the second generation of this technology and come in a compact 40-pin QFN package. They primarily address applications such as battery-powered speakers, Bluetooth/wireless/smart speakers and soundbars, conference speakers, and multi-channel/multi-room audio systems. |
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