Press Releases 295 to 300 of 1639
15.11.2022 11:15 Infineon launches the industry’s first PFC and hybrid flyback combo IC driving performance in GaN-based USB-C adapters and chargers with EPR
Munich, Germany – 15 November, 2022 – USB power delivery (USB-PD) has emerged as the prevailing standard for fast charging and for supplying power to all kinds of mobile and battery-powered devices using the unified type-C connector. In its latest release, USB-PD rev 3.1, the Extended Power Range (EPR) specification supports a wide output voltage range with high power delivery. Key drivers for the evolution of the adapter and charger market are unification and high-power capability combined with small form factors at low system cost. Fostering this trend, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) now introduces the novel XDP™ digital power XDPS2221. The highly-integrated combo controller IC for USB-PD supports high power designs in wide input and output voltage applications of up to 28 V output voltage.
14.11.2022 16:00 After a record 2022 fiscal year, Infineon significantly increases its long-term financial targets, and is planning a major investment in a new factory in Dresden; positive outlook for 2023
Neubiberg, 14 November 2022 – Infineon Technologies AG is increasing its target operating model and reporting its results for the fourth quarter and for the full fiscal year, both of which ended on 30 September 2022.
14.11.2022 14:10 Infineon and Stellantis agree on Memorandum of Understanding on multi-year delivery of silicon carbide (SiC) chips
Munich, Germany – 14 November 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and the global automaker Stellantis have signed a non-binding Memorandum of Understanding as a first step towards a potential multi-year supply cooperation for silicon carbide (SiC) semiconductors. Infineon would reserve manufacturing capacity and supply CoolSiC™ “bare die” chips in the second half of the decade to the direct Tier 1 suppliers of Stellantis. The potential sourcing volume and capacity reservation have a value of significantly more than €1 billion.
14.11.2022 12:15 Infineon introduces the industry’s first wide voltage range hot-swap controller with a programmable digital SOA control for data centers
Munich, Germany – 14 November, 2022 – Continued demand for Artificial Intelligence (AI) services in High-Performance Computing (HPC) data centers is driving the market growth in this segment. Special-purpose AI accelerators facilitate a significant increase in the performance and efficiency of these data centers. Like in many critical infrastructure systems, reliability and high availability are essential and highly challenging. Developers of AI supercomputing platforms can only address these requirements with hot-swap solutions that monitor the power supply and protect the system even when components are hot-swapped.
11.11.2022 10:15 A smart air conditioner that can "see", "hear" and "feel" its environment
Munich, 11 November 2022 – Temperatures in many regions of the world once again reached record highs this year. The demand for air conditioning systems is on the rise. In the EU, 50 percent of the energy consumed in buildings and industry is used for heating and cooling. Semiconductor technologies can play a decisive role in cutting the power consumed by these systems. Infineon Technologies AG will present a smart air conditioning system at Hall C3, Booth 502 during the electronica trade fair, which will take place from 15 to 18 November in Munich. This intelligent air conditioner significantly reduces power consumption and increases comfort thanks to targeted cooling.
09.11.2022 12:45 Infineon launches XMC7000 series for industrial applications with increased performance, memory, advanced peripherals, and extended temperature range
Munich, Germany – 9 November, 2022 – At electronica 2022, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches the XMC7000 microcontroller (MCU) family for advanced industrial applications including industrial drives, electrical vehicle (EV) charging, two-wheel electrical vehicles and robotics. The XMC7000 series offers single and dual core options of 350-MHz 32-bit Arm® Cortex®-M7 and a 100-MHz 32-bit Arm® Cortex®-M0+, up to 8 MB of embedded flash and 1 MB of on-chip SRAM. The products operate from 2.7 to 5.5 V and achieve full specification from -40°C to 125°C.
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