| 06.02.2025 10:15 |
Infineon introduces new OPTIREG™ TLF35585 power management IC for demanding automotive applications |
|
Munich, Germany – 6 February 2025 – The OPTIREG™ Power Management IC (PMIC) portfolio enables highly efficient voltage regulation, offering pre- and post-regulator architectures with DC/DC and linear regulators as well as trackers. In addition to the power supply, additional monitoring and control functions are integrated, enabling customers to develop automotive ECUs for safety-related applications. To further support developers, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is now expanding the OPTIREG PMIC family with the OPTIREG PMIC TLF35585, an integrated multi-rail power supply solution for demanding automotive systems. The TLF35585 provides a reliable power supply for AURIX™ and other microcontrollers and enables robust systems with the highest functional safety requirements. The new power supply solutions are therefore ideal for functional safety applications in harsh automotive environments, particularly in the chassis, powertrain, domain control and transmission areas. |
 |
|
| 05.02.2025 09:30 |
Infineon signed EUR 2.0 billion Revolving Credit Facility |
|
Munich, Germany – 05 February 2025 – Yesterday, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has signed a €2.0 billion revolving credit facility with a tenor of five years and two one-year extension options at each lender's discretion. |
|
|
| 04.02.2025 07:33 |
Infineon has a slightly better start to the fiscal year than expected and raises its outlook for the year due to currency effects |
|
Neubiberg, 4 February 2025 – Today, Infineon Technologies AG is reporting results for the first quarter of the 2025 fiscal year (period ended 31 December 2024). |
|
|
| 30.01.2025 14:15 |
Infineon's 512 Mbit QSPI NOR Flash for satellite applications is now qualified according to DLAM QML-V and QML-P |
|
Munich, Germany – 30 January 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced that its radiation-hardened 512 Mbit QSPI NOR Flash memory for space and extreme environment applications has now received the QML-V and QML-P qualification of the Defense Logistics Agency Land and Maritime (DLAM). The QML certification is the highest reliability standard for microcircuits awarded by the U.S. government and indicates that the device will perform reliably under the most challenging conditions. This makes the memory device the first and only QML-qualified radiation-hardened NOR flash memory for the space industry. The flash memory features a fast 133 MHz quad serial peripheral interface (QSPI) and the highest density, radiation and single-event effects (SEE) performance available in a fully QML-qualified non-volatile memory for use with space-qualified FPGAs and multi-core processors. |
|
|
| 30.01.2025 10:15 |
Infineon 2025 predictions – Gallium Nitride (GaN) semiconductors: GaN to reach adoption tipping points in multiple industries, further driving energy efficiency |
|
Munich, Germany – 30 January 2025 – As the world continues to face the challenges of climate change and environmental sustainability, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is at the forefront of innovation, harnessing the power of all relevant semiconductor materials including silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) to drive meaningful progress towards decarbonization and digitalization. |
|
|
| 29.01.2025 10:15 |
FORVIA HELLA setzt bei der nächsten Generation an Ladelösungen auf den neuen CoolSiC™ Automotive MOSFET von Infineon |
|
München, 29. Januar 2025 – FORVIA HELLA, ein internationaler Automotive-Zulieferer, hat den neuen CoolSiC™ Automotive MOSFET 1200 V der Infineon Technologies AG für seine 800-V-DCDC-Ladelösung der nächsten Generation ausgewählt. Der CoolSiC-MOSFET von Infineon ist für On-Board-Ladegeräte und DCDC-Anwendungen in 800-V-Fahrzeugarchitekturen konzipiert und wird in einem Q-DPAK-Gehäuse geliefert. Das Bauteil basiert auf der TSC-Technologie (Top-Side-Cooling), die eine hervorragende Wärmeleistung, eine einfache Montage und niedrige Systemkosten ermöglicht. |
|
|
| |
««
«
4
5
6
7
8
»
»»
|
