Press Releases 301 to 306 of 1639
08.11.2022 10:00 Infineon partners with REE Automotive to foster sustainable mobility
Munich, Germany – 8 November 2022 – Disruptive technologies are driving the mobility transformation: to accelerate green and smart mobility, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), the market leader in automotive and power semiconductors, is collaborating with REE Automotive Ltd. (NASDAQ: REE). The automotive technology company developed the REE modular Electric Vehicle platform which serves as a foundation for a wide variety of electric vehicles types, from robotaxis and commercial vans all the way to electric passenger shuttles.
04.11.2022 14:15 Infineon introduces new XENSIV™ TLE4971 sensor family for automotive applications
Munich, Germany – 4 November, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the addition of the new XENSIV™ TLE4971 family to its current sensor portfolio for automotive applications. The 3.3 V devices are the next generation of TLI4971 devices available in a TISON package with an integrated rail and available in four different pre-programmed current ranges: 25 A, 50 A, 75 A and 120 A. With a compact design and state-of-the-art sensing, the TLE4971 is ideal for automotive use cases including on-board chargers (OBC), high-voltage auxiliary drives and charging applications. Additionally, the current sensor is also ideal for industrial applications including DC chargers for electric vehicles, industrial drives, servo drives and PV inverters.
04.11.2022 10:00 Infineon at electronica 2022: Decarbonization and digitalization as key topics
Munich, 04 November 2022 – Infineon Technologies AG will be at the electronica trade fair to present its solutions for the major challenges of our time. Semiconductors make a wide variety of contributions to green and digital transformation and are the heart of every connected application. Now, at the 2022 electronica fair, Infineon is making clear why semiconductors are key elements in achieving a better future and how they help pave the way towards climate neutrality. From 15 to 18 November, Infineon's booth 502 in hall C3 will showcase intelligent and energy-efficient solutions for the connected world of tomorrow with the theme "Driving decarbonization and digitalization. Together."
03.11.2022 11:45 Infineon introduces new CMOS transceiver MMIC CTRX8181 with high performance, scalability and reliability for automotive radar
Munich, Germany – 3 November, 2022 – A high-performance and reliable radar module is the key to an improved automated driving assistance system and autonomous driving in the future. New features, such as advanced emergency braking systems (AEBs) that react to crossing motorcyclists, will demand higher performance and increased modules per car. Key drivers for this growth are NCAP programs and legislation.
02.11.2022 13:15 Infineon PSoC™ 4100S Max supports fifth-generation CAPSENSE™ technology with higher performance, lower power, and cost for HMI applications
Munich, Germany – 2 November, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the new PSoC™ 4100S Max family. It features expanded Flash memory and general-purpose inputs/outputs (GPIO) for next-generation human machine interface (HMI) applications to support the fifth-generation CAPSENSE™ touch sensors. Available in 7x7, 10x10, and 14x14 mm² packages, PSoC 4100S Max with CAPSENSE™ technology is ideal for industrial control, automotive HMI, home automation and large home appliances including robotics, inductive sensors, washing machines, refrigerators, air conditioners, smart thermostats, and printers.
31.10.2022 10:15 Infineon’s new 8- and 16-Mbit EXCELON™ F-RAM non-volatile memories now commercially available
Munich, Germany – 31 October, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced commercial availability of the industry’s highest density serial F-RAMs, the company’s new 8- and 16-Mbit EXCELON™ F-RAM memories. The 8- and 16-Mbit EXCELON F-RAM (Ferroelectric RAM) memories address the non-volatile data-logging requirements of next-generation automotive and industrial systems to help prevent data loss in harsh operating environments. The new memories feature a wide voltage operation from 1.71 V to 3.6 V, support up to 54-MBps of data throughput over a low-pin count interface, and are available in a RoHS-compliant, 24-ball FBGA package.
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