| Press Releases 307 to 312 of 1696 |
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| 01.03.2023 13:15 |
Infineon introduces highly integrated iMOTION™ IMI110 series for low-power devices |
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Munich, Germany – 1 March, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches the new intelligent power module (IPM) series iMOTION™ IMI110. The series combines the iMOTION Motion Control Engine (MCE) with a three-phase gate driver and 600 V/2 A or 600 V/4 A IGBTs in a compact DSO-22 package. The integrated motor controller series is suitable for motors in small and large household appliances as well as fans and pumps with typically 70 W output power. Depending on the system design, even higher outputs can be achieved. |
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| 28.02.2023 13:15 |
Infineon presents innovative IoT and power solutions for a greener future at Embedded World 2023 |
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Munich, Germany – 28 February, 2023 – Decarbonization and digitalization are the two defining challenges of our time. However, one cannot be achieved without the other. At Embedded World 2023 in Nuremberg, Germany, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will demonstrate both how its innovative power solutions are crucial to taking energy efficiency and smart power to the next level, and how its comprehensive IoT portfolio of sensors, actuators and microcontrollers provides reliable connectivity and robust security. Together with customers and partners, Infineon is working to overcome these challenges. |
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| 28.02.2023 10:00 |
Infineon coordinates wide-scale research initiative for supercomputers in highly automated connected vehicles |
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Munich, Germany – 28 February 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) – They will be the heart of automated connected vehicles: high-performance computers built into the car, processing all the available data and information as quickly and reliably as possible, so that the vehicles can make their way safely through traffic. The research project Mannheim-CeCaS (CentralCarServer) will develop a corresponding automotive supercomputing platform. 30 research partners from industry and universities are working in the project, which is being supported by the German federal government's large scale funding initiative for digitalization of auto-mobility. Infineon will lead and coordinate the project. Representatives from all the participating institutions met for the kick-off event today at the Campeon, Infineon's Munich corporate headquarters. |
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| 27.02.2023 14:15 |
SECORA™ Connect X: Payment solution for ultra-small devices enables NFC wireless charging |
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Munich, Germany – 27 February, 2023 – Smart wearables and IoT devices are becoming increasingly popular for a variety of applications as they offer more functionality despite severe space and power constraints. By adding NFC capabilities to wearables, they can be used to pay in stores or gain access to public transportation and office buildings. SECORA™ Connect X, an all-in-one turnkey NFC solution from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), supports this trend. The ultra-low-power, boosted NFC solution provides an easy path to EMVCo-based payments. In addition, the solution now also enables NFC wireless charging for smart wearables such as smart rings, wristbands, smartwatches and more making them more user-friendly and convenient. |
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| 27.02.2023 10:30 |
Infineon’s SECORA™ Connect can make anything a wallet; new technologies will make contactless payment easier in the future |
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Munich, Germany – 27 February, 2023 – Making payments at the beach or while playing sports will become increasingly convenient in the future, as more and more everyday objects such as watches, rings, key fobs and even items of clothing gain the ability to conduct payment transactions. As the market leader for security semiconductors, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is now driving this development forward with its SECORA™ Connect portfolio. New, robust chips whose smallest versions are less than half the size of ladybugs open up unprecedented possibilities for manufacturers to turn even small everyday objects into contactless means of payment. |
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| 24.02.2023 10:15 |
New i-ToF imager enables smallest 3D camera systems with improved quantum efficiency at optimized cost |
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Munich, Germany – 24 February, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), in collaboration with 3D time-of-flight specialist and premium partner pmdtechnologies, introduces the IRS2976C Time of Flight (ToF) VGA sensor, a performance-enhancing evolution of the IRS2877C ToF VGA sensor and novel member of the REAL3™ product family. |
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