| 23.11.2022 11:15 |
EasyPACK™4B enables single module solution for the world’s largest 352 kW photovoltaic string inverter |
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Munich, Germany – 23 November, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) recently added EasyPACK™ 4B to its industry-leading Easy power module family. The lead-type of the new family targets applications in photovoltaic string inverters. In this application it can achieve up to 352 kW and allows a significant increase in output power of about 40 percent compared to last generation PV inverter of 250 kW using EasyPACK 3B. The module aims to enable a simpler but more powerful inverter design with higher power density and reduced system costs. The device is ideal for 1500 VDC solar string inverters. |
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| 21.11.2022 10:15 |
Infineon achieves ISO/SAE 21434 process certification; AURIX™ TC4xx microcontroller family first to be standard-certified |
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Munich, Germany – 21 November, 2022 – Introduced by the United Nations Economic Commission for Europe (UNECE), the new UN R155 regulation addresses the increasing focus on cybersecurity in connected automobiles. This regulation, which came into effect from July 2022, requires vehicle manufacturers to apply a security-by-design approach to their products and processes. To enable new vehicle sales in markets covered by the R155 regulation, the vehicle manufacturer must own a valid certificate of compliance for the cybersecurity management system (CSMS) applied to each vehicle type. To achieve certification, vehicle OEMs must implement cybersecurity practices across the supply chain to reduce the overall risk of attack throughout the vehicle lifecycle – from initial concept to end-of-life. |
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| 17.11.2022 11:15 |
Infineon`s new family of 2 x 37 W audio amplifiers features second generation of MERUS™ multilevel switching amplifier technology |
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Munich, Germany – 17 November, 2022 – When designing portable and battery-powered audio devices for consumer speaker applications, maximizing battery playback time and, at the same time, maintaining excellent audio performance in a compact form and at a low system cost is essential. MERUS™ multilevel switching technology from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is designed to achieve low switching losses and highly efficient amplification at both low and high output power, bringing the desired benefits in such applications. The new ICs feature the second generation of this technology and come in a compact 40-pin QFN package. They primarily address applications such as battery-powered speakers, Bluetooth/wireless/smart speakers and soundbars, conference speakers, and multi-channel/multi-room audio systems. |
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| 15.11.2022 11:15 |
Infineon launches the industry’s first PFC and hybrid flyback combo IC driving performance in GaN-based USB-C adapters and chargers with EPR |
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Munich, Germany – 15 November, 2022 – USB power delivery (USB-PD) has emerged as the prevailing standard for fast charging and for supplying power to all kinds of mobile and battery-powered devices using the unified type-C connector. In its latest release, USB-PD rev 3.1, the Extended Power Range (EPR) specification supports a wide output voltage range with high power delivery. Key drivers for the evolution of the adapter and charger market are unification and high-power capability combined with small form factors at low system cost. Fostering this trend, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) now introduces the novel XDP™ digital power XDPS2221. The highly-integrated combo controller IC for USB-PD supports high power designs in wide input and output voltage applications of up to 28 V output voltage. |
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| 14.11.2022 16:00 |
After a record 2022 fiscal year, Infineon significantly increases its long-term financial targets, and is planning a major investment in a new factory in Dresden; positive outlook for 2023 |
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Neubiberg, 14 November 2022 – Infineon Technologies AG is increasing its target operating model and reporting its results for the fourth quarter and for the full fiscal year, both of which ended on 30 September 2022. |
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| 14.11.2022 14:10 |
Infineon and Stellantis agree on Memorandum of Understanding on multi-year delivery of silicon carbide (SiC) chips |
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Munich, Germany – 14 November 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and the global automaker Stellantis have signed a non-binding Memorandum of Understanding as a first step towards a potential multi-year supply cooperation for silicon carbide (SiC) semiconductors. Infineon would reserve manufacturing capacity and supply CoolSiC™ “bare die” chips in the second half of the decade to the direct Tier 1 suppliers of Stellantis. The potential sourcing volume and capacity reservation have a value of significantly more than €1 billion. |
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