| Press Releases 361 to 366 of 1639 |
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| 03.05.2022 10:15 |
Infineon highlights at PCIM 2022: Experience the difference in power |
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Munich, Germany – 3 May, 2022 – As a trusted partner and industry leader with decades of experience, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) offers power solutions such as CoolSiC™ and CoolGaN™ that enable higher power density, smaller size, improved performance and a greener future. At PCIM 2022 (10 to 12 May, Nuremberg/Germany), Infineon will be showcasing the latest trends in power semiconductors and wide bandgap technologies in Hall 7 at booth #412, with plenty of opportunities to discuss with the company's experts. |
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| 28.04.2022 12:30 |
Infineon welcomes the adoption of delegated articles 3.3 (d), (e), (f) of the Radio Equipment Directive by the European Commission |
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Munich, Germany – 28 April, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is committed to enabling security for the Internet of Things (IoT) and applauds the adoption of delegated articles 3.3 (d), (e), and (f) of the European Commission (EC) Radio Equipment Directive (RED, 2014/53/EU), and its goal to provide security, safety, health and privacy outcomes for the consumer and industry. The essential personal data, privacy and fraud-protection requirements in RED are planned to take effect on August 1, 2024 in the European Union (EU). All products falling under this ruling must comply with the defined standards by July 2024, the latest. |
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| 26.04.2022 10:15 |
Infineon's new Battery Management ICs offer excellent measurement performance and enable optimized battery lifetime |
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Munich, Germany – 26 April, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces a new family of battery management ICs, including TLE9012DQU and TLE9015DQU. The ICs enable an optimized solution for battery cell monitoring and balancing. Combining excellent measurement performance with the highest application robustness, the new battery management ICs are a competitive system-level solution for battery modules, cell-to-pack and cell-to-car battery topologies. The devices are suitable for a wide range of industrial, consumer and automotive applications such as mild hybrid electric vehicles (MHEV), hybrid electric vehicles (HEV), plug-in hybrid electric vehicles (PHEV) and battery-powered electric vehicles (BEV). Additional applications include energy storage systems and battery management systems for electric two- and three-wheelers. |
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| 22.04.2022 14:15 |
Infineon introduces the new IPM series CIPOS™ Tiny IM323-L6G for maximum efficiency and design flexibility |
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Munich, Germany – 22 April, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) adds a new member to the CIPOS™ Tiny Intelligent Power Module (IPM) family: the CIPOS Tiny IM323-L6G 600 V 15 A. The new IPM is based on TRENCHSTOP™ IGBT RC-D2 switches and state-of-the-art SOI gate driver technology to realize maximum efficiency and improved reliability, along with minimized system size and cost. The integration of discrete power semiconductors and drivers in one package allows designers to reduce the time and effort spent on design, significantly shortening the time-to-market. The module is suitable for major home appliances, in particular drives for room air conditioners. |
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| 14.04.2022 10:15 |
Infineon’s industry first space-qualified serial interface F-RAM provides 2 Mb density non-volatile storage for extreme environments |
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Munich, Germany – 14 April 2022 – Infineon Technologies LLC, part of Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), today announced the availability of the space industry’s first radiation-hardened (rad hard), serial interface Ferroelectric RAM (F-RAM) for extreme environments. The new devices deliver unsurpassed reliability and data retention and are more energy efficient than non-volatile EEPROM and serial NOR Flash devices for space applications. |
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| 13.04.2022 12:45 |
Infineon extends CoolSiC™ M1H technology portfolio with 1200 V SiC MOSFETs, using enhanced features for highest system efficiency |
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Munich, Germany – 13 April 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces a new CoolSiC™ technology: the CoolSiC™ MOSFET 1200 V M1H. The advanced silicon carbide (SiC) chip will be implemented in a widely extended portfolio using the popular Easy module family, along with discrete packages using .XT interconnect technology. The M1H chip offers high flexibility and is suitable for solar energy systems, such as inverters, that have to meet peak demand. The chip is also ideal for applications such as fast EV charging, energy storage systems and other industrial applications. |
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