Press Releases 403 to 408 of 1697
14.06.2022 10:15 Infineon adds the AIROC™ CYW20820 Bluetooth® & Bluetooth® LE system on chip for flexibility, low power, and high-performance connectivity
Munich, Germany – 14 June, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is adding the AIROC™ CYW20820 Bluetooth® & Bluetooth® LE (low energy) system on chip (SoC) to its AIROC Bluetooth Portfolio. The AIROC CYW20820 Bluetooth & Bluetooth LE SoC is a Bluetooth 5.2 core spec compliant device tailor made for IoT applications. It is designed to support a wide spectrum of use cases for home automation and sensors including medical, home, security, and industrial, as well as lighting, Bluetooth Mesh, or any IoT application that needs Bluetooth LE or dual mode Bluetooth connectivity.
09.06.2022 14:00 Infineon presents the world's first ISO26262-compliant high-resolution 3D image sensor for automotive
Munich, Germany – 9 June, 2022 – Innovative car cockpits, seamless connectivity with new services and improved passive safety: 3D depth sensors play a key role in monitoring systems in the vehicle cabin. They are essential to meet regulations as well as NCAP ratings and to realize the vision of the driver becoming a passenger. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), in collaboration with 3D time-of-flight system specialist pmdtechnologies ag, has therefore developed the second generation of the REAL3™ automotive image sensor – an ISO26262-complient high resolution 3D image sensor.
08.06.2022 10:45 “Building new Connections:” Infineon links digital to the real world with new decarbonization and IoT solutions at EW Nuremberg 2022
Munich, Germany – 8 June, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced plans to highlight how it links the real to the digital world by enabling smart and connected applications at Embedded World 2022 in Nuremberg. A prerequisite for unlocking the potential of the IoT and decarbonization. The company will showcase a variety of smart IoT applications in sectors including smart building and homes, smart factories and smart mobility, along with its latest software and tools for system builders and makers working across the electronics industry.
07.06.2022 10:15 Infineon’s OPTIGA™ Trust M Express and CIRRENT™ Cloud ID offer easiest way to securely deploy IoT devices to the cloud at scale
Munich, Germany – 7 June, 2022 – In IoT systems, trust is the foundation for all interactions between devices and cloud services. For this reason each device must have a secured identity as unique and must be able to proof that they are what they claim to be. Additionally, OEMs are facing the challenge of having to implement this secured ID for hundreds of thousands of devices. Combining OPTIGA™ Trust M Express and CIRRENT™ Cloud ID, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) offers a high-end security solution that provides a hardware anchor of trust used to connect IoT devices easily to the cloud at scale.
03.06.2022 15:45 Infineon stands by the side of Ukraine
Munich, Germany – 03 June 2022 – One hundred days after the start of the war, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) reaffirms its solidarity with the people of Ukraine. “We show our unity with the Ukrainians who are fearlessly defending their freedom and hope that violence and suffering will soon come to an end,” said Constanze Hufenbecher, Chief Digital Transformation Officer at Infineon.
01.06.2022 10:15 ENPOWER first to adopt Infineon's latest 750 V automotive-grade discrete IGBT EDT2 devices
Munich, Germany – 1 June, 2022 – Zhuhai ENPOWER Electric Co., Ltd. (ENPOWER), a China based leading supplier of inverters for the automotive industry, is the first to integrate the latest 750 V automotive-grade IGBTs AIKQ120N75CP2 and AIKQ200N75CP2 from Infineon Technologies AG (FSE:IFX / OTCQX: IFNNY). The discrete IGBT EDT2 devices in TO-247PLUS package enable performance boosts and system cost savings in main inverter applications and DC link discharge switches of electric vehicles. Additionally, they offer greater design freedom for achieving system integration targets.
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