Press Releases 451 to 456 of 1698 |
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20.01.2022 10:15 |
Automotive dual high-side gate driver EiceDRIVER™ 2ED4820-EM with SPI protects dependable 48 V battery systems |
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Munich, Germany – 20 January, 2022 – Battery systems for 48 V are used in multiple, growing market categories including Mild Hybrid Electrical Vehicles, trucks, e-wheelers and battery packs for solar panels. These Li-ion battery systems need to be protected against negative and positive voltages. In addition, these batteries must be able to quickly and reliably disconnect from loads within microseconds, in the event of an overcurrent. Since a battery unit may not be dedicated to one vehicle, status diagnostic and protection threshold configurability are key. |
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19.01.2022 10:45 |
Solutions Hub for SEMPER™ NOR Flash memories simplifies design, speeds time-to-market for safety-critical applications |
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Munich, Germany – 19 January, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced additional development tools supporting the award-winning family of SEMPER™ NOR Flash devices. With the SEMPER Solutions Hub, a one-stop portal with all the building blocks needed to integrate SEMPER NOR Flash into an application, developers can quickly design safety-critical and inherently secured automotive, industrial and communications systems. |
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18.01.2022 10:15 |
Infineon's new generation MOTIX™ single half-bridge ICs come in a 60 percent smaller package while achieving up to 47 percent lower on-resistance |
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Munich, Germany – 18 January, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) presents the new MOTIX™ BTN99xx (NovalithIC™+), a unique family of intelligent integrated half-bridges and the direct successor to the BTN89xx. Besides a p-channel high-side and an n-channel low-side MOSFET, BTN99xx also includes smart driver ICs fully integrated in a single package. Its ease-of-use, advanced protection and scalability make the family ideal for a wide range of automotive applications. In addition, the integration of functions in a single rugged package makes the BTN99xx suitable for applications where low PCB consumption is critical. Due to its reliability, it is also a perfect fit for seat controls, electric tailgates and sliding doors, fuel pumps and other applications. |
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07.01.2022 10:00 |
New OptiMOS™ power MOSFET package enables innovative Source-Down technology for PQFN 3.3 x 3.3 mm2 in 25 V to 100 V variants |
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Munich, Germany – 7 January, 2022 – High power density, optimized performance, and ease of use are key requirements when designing modern power systems. To offer practical solutions for design challenges in end applications, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches the new generation of OptiMOS™ Source-Down (SD) power MOSFETs. They come in a PQFN 3.3 x 3.3 mm2 package and a wide voltage class ranging from 25 V up to 100 V. This package sets a new standard in power MOSFET performance, offering higher efficiency, higher power density, superior thermal management and low bill-of-material (BOM). The PQFN addresses applications including motor drives, SMPS for server and telecom and OR-ing, as well as battery management systems. |
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05.01.2022 15:15 |
Infineon and Deeyook jointly enable precise location solution with low-power Wi-Fi chipset |
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Munich, Germany, and Tel Aviv, Israel – 5 January, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Deeyook today announced their collaboration on location solutions. The location-as-a-service (LaaS) company has invented and patented an award-winning tracking solution to determine indoor and outdoor locations of items, assets, and employees. Both companies fuse Deeyook’s ultra-precise, innovative algorithms into Infineon’s best-in-class, low power AIROC™ Wi-Fi® portfolio to enable an accurate, passive, ubiquitous, and efficient location solution. |
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05.01.2022 10:45 |
First silicon available: Infineon further strengthens leading position as automotive semiconductor supplier with next-generation AURIX™ TC4x |
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Munich, Germany – 5 January, 2022 – As the global market leader in automotive semiconductors, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) continues its innovation path to shape future mobility. The company today announced the extension of its AURIX™ microcontroller family and availability of the first samples of the company’s new AURIX TC4x family of 28 nm microcontrollers (MCUs) for next-generation eMobility, ADAS, automotive E/E architectures and affordable artificial intelligence (AI) applications. |
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