| Press Releases 49 to 54 of 1639 |
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| 16.07.2024 11:15 |
Innovative smart cockpit offering from Infineon and MediaTek enable cost efficient infotainment solutions for smart mobility |
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Munich, Germany – 16 July 2024 – The trend in the automotive industry is towards digital cockpits, with buttons and controls disappearing from the dashboard and being replaced by advanced displays. As one of the key systems in a vehicle, the digital cockpit system needs to deliver high performance features to the vehicle users while meeting functional safety targets. The traditional way to achieve such goals is to run the digital cockpit system on a high-performance SoC with a hypervisor. However, the up-front investment required to get started with such a system is in the seven-figure range, and the license fees for the operating system and hypervisor add to the overall cost of the system, making it economically unattractive for mid- to low-end car models. |
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| 03.07.2024 14:15 |
Infineon and Swoboda cooperate to develop high-performance current sensors for electromobility |
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Munich, Germany – 3 July 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Swoboda jointly develop and market high-performance current sensor modules for automotive applications. The partnership combines the best-in-class current sensor ICs from Infineon with Swoboda's expertise in the development and industrialization of sensor modules to address the fast-growing market of sensing solutions for hybrid and electric vehicles. The collaborative high-performance current measurement solutions accelerate time-to-market for high-volume applications such as traction inverters and battery management systems, but also for other key automotive applications. |
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| 24.06.2024 10:15 |
Infineon extends its AIROC™ Wi-Fi 6/6E portfolio by introducing the powerful CYW5591x family of connected microcontrollers |
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Munich, Germany – 24 June 2024 – Today, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced the company’s new AIROC™ CYW5591x Connected Microcontroller (MCU) product family. The new family integrates robust, long-range Wi-Fi 6/6E and Bluetooth® Low Energy 5.4 along with a secured and versatile MCU to allow customers to build cost-optimized, power-efficient, small form-factor products for smart home, industrial, wearables, and other IoT applications. The flexible platform accelerates customers’ time-to-market with ModusToolbox™ software, RTOS and Linux host drivers, a fully validated Bluetooth stack and multiple sample code examples, Matter software enablement, and support for Infineon’s worldwide partner network. |
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| 20.06.2024 10:15 |
Infineon announces availability of its CoolGaN™ 700 V power transistors for increased performance in consumer and industrial applications |
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Munich, Germany – 20 June 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the new CoolGaN™ Transistor 700 V G4 product family. The devices are highly efficient for power conversion in the voltage range up to 700 V. In contrast to other GaN products on the market, the input and output figures-of-merit of these transistors provide a 20 percent better performance, resulting in increased efficiency, reduced power losses, and more cost-effective solutions. The combination of electrical characteristics and packaging ensures maximum performance in many applications such as consumer chargers and notebook adapters, data center power supplies, renewable energy inverters, and battery storage. |
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| 18.06.2024 10:15 |
Infineon extends radiation-hardened memory portfolio with industry’s first space qualified parallel interface 1 and 2 Mb F-RAMs |
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Munich, Germany – 18 June 2024 – Space-based applications are an important area for Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), with the company’s products being used in satellites, mars rover instruments and space telescopes, all of which require highest reliability even under the most adverse conditions. Infineon today announced availability of the industry’s first radiation-hardened (rad hard) 1 and 2 Mb parallel interface ferroelectric-RAM (F-RAM) nonvolatile memory devices. These additions to Infineon’s extensive portfolio of memories feature unsurpassed reliability and endurance, with up to 120 years of data retention at 85-degree Celsius, along with random access and full memory write at bus speeds. |
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| 13.06.2024 11:30 |
Infineon receives German Brand Award for “Corporate Brand of the Year” |
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Munich, Germany – 13 June 2024 – Today, Infineon Technologies AG received the German Brand Award in the renowned “Best of Category” as “Excellent Brands – Corporate Brand of the Year”. The German Council of Design recognizes Infineon’s exceptional brand development, highlighting the company’s dedication to establishing a consistent brand that harmonizes seamlessly with its corporate strategy. |
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