| Press Releases 511 to 516 of 1640 |
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| 03.12.2020 17:45 |
EiceDRIVER™ X3 Enhanced family for greater design flexibility and reduced hardware complexity |
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Munich, Germany – 3 December 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched the EiceDRIVER™ X3 Enhanced analog (1ED34xx) and digital (1ED38xx) gate driver ICs. These devices provide a typical output current of 3, 6 and 9 A, precise short-circuit detection, a Miller clamp and soft turn-off. In addition, 1ED34xx offers an adjustable desaturation filter time and soft turn-off current with external resistors. These features combine to accelerate design cycles due to a lower external component count. 1ED38xx provides I²C configurability for multiple parameters. This increases design flexibility, reduces hardware complexity and shortens evaluation time. These gate drivers are suitable for industrial drives, solar systems, uninterruptible power supplies, EV chargers and other industrial applications.
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| 02.12.2020 09:15 |
CoolSiC™ CIPOS™ Maxi: World's first 1200 V transfer molded IPM with SiC |
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Munich, Germany – 2 November 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched a 1200 V transfer molded silicon carbide (SiC) integrated power module (IPM) and concludes the massive roll-out of SiC solutions for this year. The CIPOS™ Maxi IPM IM828 series is the industry’s first in this voltage class. The series provides a compact inverter solution with an excellent thermal conduction and a wide range of switching speed for three-phase AC motors and permanent magnet motors in variable speed drive applications. Amongst others, these can be found in industrial motor drives, pumps drives, and active filters for heating, ventilation, and air conditioning (HVAC). |
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| 26.11.2020 14:45 |
1200 V level-shift three-phase SOI EiceDRIVER™ offers superior robustness |
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Munich, Germany – 26 November 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) broadens its level-shift EiceDRIVER™ portfolio with a 1200 V three-phase gate driver. It is based on the company’s unique silicon-on-insulator (SOI) technology. The device provides leading negative VS transient immunity, superior latch-up immunity, fast over-current protection, and the monolithic integration of real bootstrap diodes. These unique features reduce BOM and enable a more robust design with a compact form factor suitable for industrial drives and embedded inverter applications. |
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| 23.11.2020 14:15 |
Infineon’s SECORA™ Pay solutions enable contactless payments with environmentally friendly card body materials |
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Munich, Germany – 23. November 2020 – Contactless payment innovations from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) contribute to a more sustainable use of resources. To support the payment industry’s move towards the use of more environmentally friendly materials for smart card manufacturing, Infineon is now offering a complete, single-source solution that is easily adaptable to different projects and market requirements. SECORA™ Pay with Coil-on-Module (CoM) package comes with a newly developed antenna, specifically designed for cards made from recycled ocean-bound plastic or wood. It is the industry-wide thinnest payment module with a copper wire antenna, which allows cost-efficient card manufacturing for mass deployment. |
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| 20.11.2020 10:15 |
All-in-one solution featuring the highest efficiency class: solar inverter from Fronius uses CoolSiC™ MOSFETs |
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Munich, Germany, and Wels, Austria – 20 November 2020 – A few weeks ago Fronius International GmbH launched the Symo GEN24 Plus solar inverter. Its Multiflow technology makes it suitable for a wide range of applications supporting energy self-sufficiency. Not only does it provide power for direct use in the household, but it also offers an interface for energy storage systems. In addition, the hybrid inverter is designed for water heating and the charging of electric cars, and can be connected to external systems. All this thanks to silicon carbide (SiC) from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) with an efficiency of over 98 percent. In combination with the high voltage storage from BYD, the Symo GEN24 Plus achieved a record value in the System Performance Index (SPI) of 94 percent in the 10 kW class. It was the only one in this combination to achieve Class A energy efficiency. |
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| 16.11.2020 14:45 |
Infineon’s SECORA™ ID X drives introduction of contactless multi-application ID solutions based on JAVA Card™ |
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Munich, Germany – 16 November 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) extends its easy-to-integrate security solutions for contactless electronic ID documents. SECORA™ ID X is the company’s new flagship for highly secured yet versatile government ID solutions targeting customized applications. The solution’s particularly large user memory of up to 450 kByte allows to realize a broad variety of eID products ranging from identification only to multifunctional cards that combine identification, digital signature and secured web access. |
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