Press Releases 547 to 552 of 1640
13.07.2020 10:15 Virtual Sensor Experience: Infineon's digital sensor booth with live presentations from July 20 to 22, 2020
Munich, Germany – 13 July, 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is continuing its virtual trade show strategy and will present the company's sensor solutions live from July 20 to 22, 2020. The in-house digital trade show "Virtual Sensor Experience" (VSE) will focus on the automotive, consumer and industrial sectors. With 22 product demonstrations, 15 live presentations and a digital Makers' Corner, Infineon will offer customers, partners and media detailed insights into its portfolio. After the live program ends on July 22, all information will be available on demand until the end of August.
08.07.2020 09:00 Europe’s most powerful 400 kW DC charger: CoolSiC™ for ultra-fast pit stops
Munich, Germany, and Bilbao, Spain - 8 July 2020 - Spain based power conversion group Ingeteam and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) team up for best customer experience in superfast electric vehicle (EV) charging. Rated at 400 kW, the converter INGEREV® RAPID ST400 from Ingeteam is based on CoolSiC™ MOSFETs in an EasyDUAL™ 2B housing. ...
07.07.2020 14:00 Motor System ICs from Infineon for control of small electric motors in cars offer a completely new level of integration
Munich, Germany - 7 July, 2020 - From power lift gate and sunroof to electric seat adjustment and fuel pumps, an increasingly large number of electric motors ensure safety and comfort in modern cars. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is now presenting a new product family called Motor System ICs designed for control of both brushed and brushless DC motors. ...
30.06.2020 14:00 New silicon carbide power module for electric vehicles
Munich, Germany – 30 June 2020 – Silicon carbide in electric vehicles stands for more efficiency, higher power density and performance. Particularly with an 800 V battery system and a large battery capacity, silicon carbide leads to a higher efficiency in inverters and thus enables longer ranges or lower battery costs. ...
29.06.2020 15:00 CoolSiC™ 62 mm module opens up new applications for silicon carbide
Munich, Germany – 29 June 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) adds another industry standard package to its CoolSiC™ MOSFET 1200 V module family. The proven 62 mm device has been designed in half-bridge topology and is based on the trench chip technology. It opens up silicon carbide for applications in the medium power range starting at 250 kW – where silicon reaches the limits of power density with IGBT technology. Compared to a 62 mm IGBT module, the list of applications now additionally includes solar, server, energy storage, EV charger, traction, commercial induction cooking and power conversion systems.
29.06.2020 12:55 A class of its own: Advanced H2S protection of IGBT modules enhances lifetime
Munich, Germany - 29 June 2020 - Ruggedness determines the longevity and thus the reliability of modules for applications used in harsh environments. In particular the exposure to hydrogen sulfide (H2S) has a critical impact on the lifetime of electronic components. To respond to this threat, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has developed a unique protection feature. EconoPACK™ + modules with a TRENCHSTOP™ IGBT4 chipset are the first of the Econo portfolio featuring this new level of protection for inverters. ...
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