| Press Releases 7 to 12 of 1628 |
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| 15.10.2024 11:13 |
HybridPACK™ Drive G2 Fusion: Infineon combines silicon and silicon carbide in a cutting-edge power module for e-mobility |
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Munich, Germany – 15 October 2024 – Affordability combined with high performance and efficiency is the key to making electric mobility accessible to a broader market. That's why Infineon Technologies AG is introducing the HybridPACK™ Drive G2 Fusion, establishing a new power module standard for traction inverters in the e-mobility sector. The HybridPACK Drive G2 Fusion is the first plug'n'play power module that implements a combination of Infineon’s silicon and silicon carbide (SiC) technologies. This cutting-edge solution provides an ideal balance between performance and cost efficiency, giving more choice in the optimization of inverters. |
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| 14.10.2024 14:15 |
New Automotive PSoC™ Multitouch controller supports OLED and ultra-large screens with superior touch performance |
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Munich, Germany – 14 October 2024 – In the ever-evolving automotive industry, users demand a seamless Human-Machine-Interface (HMI) experience for their infotainment application. Customers are looking for large touchscreens with advanced features and are venturing into OLED and Micro OLED as their choice of display. OLED is seen as the future of smart mobility applications, enabling flexible design and free-form shapes. Best customer experience coupled with functional safety standards must go hand in hand to provide a seamless journey for the end user. To address these challenges, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the Automotive PSoC™ Multitouch GEN8XL (IAAT818X), a new generation of touch controllers. Designed for OLED and micro-LED displays up to 24 inches, the touch controller delivers performance and frame rates that meet today's demands. It ensures a seamless user experience on various touch-based interfaces, such as touchscreens, touchpads, and sliders, while meeting the rigorous automotive standards for electromagnetic compatibility (EMC IEC 61967), including chip-level emission, conducted emission (IEC 62132), and radiated emission (ISO 11452). |
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| 11.10.2024 14:15 |
Infineon introduces new fingerprint sensor ICs for identification and authentication in automotive applications |
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Munich, Germany – 11 October 2024 – Fingerprint sensing offers accurate and cost-effective biometric performance. Compared to other means of authentication like using a smartphone or typing a pin in a user interface of the vehicle, fingerprint sensing provides less hassle and better ease of use for the driver. For those reasons, biometric functions are a rising trend in the automotive industry. To address this, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches the new automotive-qualified fingerprint sensor ICs CYFP10020A00 and CYFP10020S00. The devices are optimized for attaching to Infineon's TRAVEO™ T2G microcontroller family and comply with the AEC-Q100 requirements for the automotive industry. The sensors offer powerful fingerprint identification and authentication capabilities. This makes them ideal for in-vehicle personalization and payment authentication, such as charging, parking or other services, as well as for authentication and identification applications outside the automotive sector. Infineon has partnered with Precise Biometrics for Biomatch algorithm software to provide a best-in-class fingerprint identification and authentication solution. |
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| 11.10.2024 10:00 |
Infineon intensifies collaboration on CO2 reduction targets with suppliers and honors top performers with Green Awards |
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Munich, Germany – 11 October 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), is intensifying its collaboration with suppliers to further reduce CO2 emissions along the whole supply chain. Infineon hosted its first ever Supplier Sustainability Summit to further stimulate collaboration and incentivize and support suppliers to accelerate their decarbonization journeys. The virtual event brought together about 100 top semiconductor industry suppliers. |
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| 10.10.2024 15:45 |
Infineon und AWL-Electricity kooperieren bei Entwicklung zur Verbesserung von Wireless-Stromversorgungslösungen mit GaN-Leistungshalbleitern |
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München, 10. Oktober 2024 – Die Infineon Technologies AG, ein weltweit führender Halbleiterhersteller in den Bereichen Stromversorgungssysteme und IoT, hat heute eine Partnerschaft mit dem kanadischen Unternehmen AWL-Electricity Inc. bekannt gegeben, einem Pionier auf dem Gebiet der MHz-resonanten kapazitiven Kopplungstechnologie für Energieübertragung. Infineon stellt AWL-E CoolGaN™ GS61008P-Transistoren zur Verfügung, das die Entwicklung fortschrittlicher kabelloser Lösungen für die Energieübertragung ermöglicht – und neue Wege zur Lösung von Stromversorgungsproblemen in verschiedenen Branchen eröffnet. |
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| 10.10.2024 10:15 |
Infineon’s EiceDRIVER™ 125 V high-side gate driver protects battery-driven applications in the event of a fault |
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Munich, Germany – 10 October 2024 – In battery-powered applications such as motor drives and switched-mode power supplies (SMPS), the power supply architecture often requires that a module can be disconnected from the main supply rail when a fault occurs in that module. To achieve this functionality, it is common to use high-side disconnect switches (e.g. MOSFETs) to prevent a load short circuit from affecting the battery. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has now introduced the EiceDRIVER™ 1EDL8011, a high-side gate driver designed to protect battery-powered applications such as cordless power tools, robotics, e-bikes, and vacuum cleaners in the event of a fault. |
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