Press Releases 601 to 606 of 1640
23.01.2020 12:00 Miniature power supply: Infineon starts first flip-chip production specifically designed for automotive applications
Munich, Germany – 23 January 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is taking the next step towards smallest power supply devices for automotive electronics. As first chipmaker, the company set up a dedicated production process for flip-chip packages that is fully aligned with the...
21.01.2020 10:00 SMA and Infineon reduce system costs for inverters
Niestetal/Munich, Germany – January 21, 2020 – The installed photovoltaic capacity is growing rapidly worldwide. Photovoltaic systems with a total output of around 600 GW now supply clean and cost-effective electricity – replacing around 600 medium-sized coal-fired power plants. ...
13.01.2020 15:15 Infineon Supervisory Board with new line-up after the Annual General Meeting 2020
Munich, Germany - 13 January 2020 - The terms of office of all employee representatives on the Supervisory Board and of six of the eight members on the side of the shareholders will expire at the close of the Annual General Meeting of Infineon Technology AG (FSE: IFX / OTCQX: IFNNY) ...
09.01.2020 09:00 Infineon partnering with Rompower: Expansion of the competence for system solutions of universal chargers
Munich, Germany - 09. January 2020 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands with Rompower its expertise for the development of universal chargers with high efficiency and compact design. These USB-PD chargers (Power Delivery) with the universal USB-C connector enable the power ...
08.01.2020 11:15 650 V half-bridge SOI driver families with integrated bootstrap diodes offers superior robustness
Munich, Germany – 8 January 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) broadens its EiceDRIVER™ portfolio with the 650 V half-bridge gate drivers based on Infineon’s unique silicon on insulator (SOI) technology. The products provide leading negative transient voltage immunity, ...
06.01.2020 11:35 CES 2020: Infineon presents the world’s smallest 3D image sensor for face authentication and photo effects on smartphones and the like
Munich/Las Vegas, Germany/USA, 6 January 2020 – Reliable face authentication, improved photo functions and authentic augmented reality experiences: 3D depth sensors assume a key role in smartphones and for applications that rely on accurate 3D image data. Infineon Technologies AG has collaborated...
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