Press Releases 655 to 660 of 1640
02.05.2019 10:15 Groundbreaking technology in the audio market: Infineon launches class D audio brand MERUS™ with integrated multilevel amplifier ICs
Munich, Germany – 2 May 2019 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches its MERUS™ brand, uniting the existing portfolio of multi-chip modules and discrete audio products under one umbrella. The brand will spearhead the belief that the best audio amplifier ICs
›    produce sound in t...
30.04.2019 11:15 CIPOS™ Tiny complements Infineon’s families of IPMs
Munich, Germany – 30 April 2019 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) adds a new member to its growing family of intelligent power modules (IPMs): CIPOS™ Tiny. The 3-phase inverter module is the newest generation of IPM to offer the highest power density for variable speed motor drive...
29.04.2019 13:45 Powering next generation datacenters: Infineon’s 48 V high-efficiency, two-stage architecture power distribution
Munich, Germany – 29 April 2019 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is introducing its zero-voltage-switching (ZSC) switched capacitor converter. It features a two-stage architecture for 48 V applications to power up CPUs, GPUs, SoCs, ASICs, and memory. Infineon’s full system ...
23.04.2019 09:45 Success in Japan: Infineon is outgrowing all other leading suppliers of automotive semiconductors
Munich, Germany / Tokyo, Japan – 23 April 2019 – Strong growth in a strategically important market: According to the latest research from Strategy Analytics*, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) increased its automotive business in Japan by almost 25 percent in 2018. It thus grew fast...
15.04.2019 10:15 Adding a new package to the Easy family, Infineon now offers the broadest 12 mm power module portfolio without base plate
Munich, Germany – 15 April 2019 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has extended its Easy family to include a new package: Easy 3B. Together with the other Easy 1B and 2B packages, this comprises the broadest power module portfolio at 12 mm height without base plate. Easy 3B is the ...
04.04.2019 11:30 New 3,3 kV XHP™ 3 power module from Infineon for compact and scalable inverter designs
Munich, Germany – 4 April 2019 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) extents its large portfolio of high voltage devices with a new package:
XHP™ 3. This is a new flexible IGBT module platform for high-power applications in the voltage range from 3,3 kV up to 6,5 kV. The module ...
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