Press Releases 691 to 696 of 1640
26.11.2018 07:15 Infineon strengthens collaboration with DENSO – DENSO becoming  a shareholder
Munich, Germany - 26 November 2018 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is strengthening its long-term partnership with DENSO Corporation, a global supplier of advanced automotive technology, systems and components, to bolster its automotive business. ...
23.11.2018 11:30 Infineon’s Blockchain Security 2Go starter kit protects digital transactions
Munich, Germany – 23 November 2018 – Digital transactions require secured yet user-friendly solutions. This applies all the more so for Blockchain applications where the user credentials are one of the most critical security aspects of the system. With its new Blockchain Security 2Go starter kit, ...
21.11.2018 08:00 Chief Financial Officer Dominik Asam to move from Infineon to Airbus SE  in April 2019
Munich, Germany, 21 November 2018 – Dominik Asam, Chief Financial Officer of Infineon Technologies AG, has notified the company’s Supervisory Board of his intent to move to Airbus SE as Chief Financial Officer as of 1 April 2019. The Supervisory Board has with extraordinary regret accepted Dominik A...
14.11.2018 10:15 Strong, robust and precise: new 2-channel isolated gate-driver IC family from Infineon
Munich, Germany – 14 November 2018 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces a new family of 2-channel isolated EiceDRIVER™ ICs for use in high-performance power conversion applications. The new gate-driver IC family is ideally suited for high-voltage PFC and DC-DC stages as ...
13.11.2018 08:15 Gallium nitride solutions from Infineon are in volume production
Munich, Germany – 13 November 2018 – At electronica 2018 Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) showcases the benefits of its gallium nitride (GaN) solutions: CoolGaN™ 600 V e-mode HEMTs and GaN EiceDRIVER™ ICs. They offer a higher power density enabling smaller and lighter designs, lowe...
12.11.2018 09:15 Infineon acquires Siltectra, a specialist for silicon carbide
Munich and Dresden, Germany – 12 November 2018 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) acquires Siltectra GmbH, a start-up based in Dresden. The start-up has developed an innovative technology (Cold Split) to process crystal material efficiently and with minimal loss of material. Infineon will use the Cold Split technology to split silicon carbide (SiC) wafers, thus doubling the number of chips out of one wafer. A purchase price of 124 million Euros was agreed on with the venture capital investor MIG Fonds, the main shareholder.
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