| 11.10.2024 14:15 |
Infineon introduces new fingerprint sensor ICs for identification and authentication in automotive applications |
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Munich, Germany – 11 October 2024 – Fingerprint sensing offers accurate and cost-effective biometric performance. Compared to other means of authentication like using a smartphone or typing a pin in a user interface of the vehicle, fingerprint sensing provides less hassle and better ease of use for the driver. For those reasons, biometric functions are a rising trend in the automotive industry. To address this, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches the new automotive-qualified fingerprint sensor ICs CYFP10020A00 and CYFP10020S00. The devices are optimized for attaching to Infineon's TRAVEO™ T2G microcontroller family and comply with the AEC-Q100 requirements for the automotive industry. The sensors offer powerful fingerprint identification and authentication capabilities. This makes them ideal for in-vehicle personalization and payment authentication, such as charging, parking or other services, as well as for authentication and identification applications outside the automotive sector. Infineon has partnered with Precise Biometrics for Biomatch algorithm software to provide a best-in-class fingerprint identification and authentication solution. |
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| 11.10.2024 10:00 |
Infineon intensifies collaboration on CO2 reduction targets with suppliers and honors top performers with Green Awards |
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Munich, Germany – 11 October 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), is intensifying its collaboration with suppliers to further reduce CO2 emissions along the whole supply chain. Infineon hosted its first ever Supplier Sustainability Summit to further stimulate collaboration and incentivize and support suppliers to accelerate their decarbonization journeys. The virtual event brought together about 100 top semiconductor industry suppliers. |
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| 10.10.2024 15:45 |
Infineon und AWL-Electricity kooperieren bei Entwicklung zur Verbesserung von Wireless-Stromversorgungslösungen mit GaN-Leistungshalbleitern |
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München, 10. Oktober 2024 – Die Infineon Technologies AG, ein weltweit führender Halbleiterhersteller in den Bereichen Stromversorgungssysteme und IoT, hat heute eine Partnerschaft mit dem kanadischen Unternehmen AWL-Electricity Inc. bekannt gegeben, einem Pionier auf dem Gebiet der MHz-resonanten kapazitiven Kopplungstechnologie für Energieübertragung. Infineon stellt AWL-E CoolGaN™ GS61008P-Transistoren zur Verfügung, das die Entwicklung fortschrittlicher kabelloser Lösungen für die Energieübertragung ermöglicht – und neue Wege zur Lösung von Stromversorgungsproblemen in verschiedenen Branchen eröffnet. |
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| 10.10.2024 10:15 |
Infineon’s EiceDRIVER™ 125 V high-side gate driver protects battery-driven applications in the event of a fault |
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Munich, Germany – 10 October 2024 – In battery-powered applications such as motor drives and switched-mode power supplies (SMPS), the power supply architecture often requires that a module can be disconnected from the main supply rail when a fault occurs in that module. To achieve this functionality, it is common to use high-side disconnect switches (e.g. MOSFETs) to prevent a load short circuit from affecting the battery. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has now introduced the EiceDRIVER™ 1EDL8011, a high-side gate driver designed to protect battery-powered applications such as cordless power tools, robotics, e-bikes, and vacuum cleaners in the event of a fault. |
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| 09.10.2024 10:15 |
Infineon launches ultra-high current density power modules to enable high-performance AI computing |
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Munich, Germany – 9 October 2024 – Data centers are currently responsible for more than two percent of global energy consumption. Fueled by AI, this number is expected to grow to up to around seven percent in 2030, matching the current energy consumption of India. Enabling efficient power conversion from grid-to-core is vital to enable superior power densities and thereby advance compute performance while reducing total cost of ownership (TCO). Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is therefore launching the TDM2354xD and TDM2354xT dual-phase power modules with best-in-class power density for high-performance AI data centers. These modules enable true vertical power delivery (VPD) and offer industry's best current density of 1.6 A/mm2. They follow the TDM2254xD dual-phase power modules introduced by Infineon earlier this year. |
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| 08.10.2024 15:15 |
Infineon adds new automotive-grade laser driver to leading REAL3™ Time-of-Flight portfolio |
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Munich, Germany – 8 October 2024 – Innovative car cockpits, seamless connectivity with new services and improved passive safety: 3D depth sensors play an important role in in-vehicle monitoring systems. They are essential for meeting the requirements and safety ratings of the European New Car Assessment Programme (NCAP) and for implementing differentiating comfort features. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has developed the highly integrated IRS9103A vertical cavity surface emitting laser (VCSEL) driver IC for automotive applications. In combination with Infineon's REAL3™ image sensor, the automotive-grade laser diode driver IC enables size-, cost- and performance-optimized designs of 3D camera modules. |
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