| Press Releases 85 to 90 of 1692 |
 |
| 12.09.2024 11:15 |
Infineon receives 2024 ASCM award of excellence |
|
Munich, Germany – 12 September 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has received the “ASCM Award of Excellence – Corporate Transformation” from the Association for Supply Chain Management (ASCM), the global leader in supply chain learning, transformation, innovation and leadership. The award recognizes an organizational transformation that improves business by assessing the supply chain using ASCM's global standards, products, services and resources. Infineon was honored for a supply chain initiative that implemented the Supply Chain Operations Reference (SCOR) model of ASCM. By focusing on customer-centricity, Infineon significantly improved customer satisfaction, optimized capacity use and realized substantial cost savings. |
|
|
| 12.09.2024 10:00 |
Automated driving: ZF and Infineon use AI algorithms to optimize software and control units for driving dynamics |
|
Friedrichshafen and Munich, Germany – 12 September 2024 – Trucks automatically driving behind one another on the highway, 'platooning', or cars automatically changing lanes: Here vehicle movements have to be calculated and executed precisely and quickly without a human driver. Software and AI algorithms safely control the drive, brakes, front and rear wheel steering and damping systems. The more efficient the AI algorithms are, the better the available computing power can be used. |
|
|
| 11.09.2024 12:30 |
Infineon nominated for “Deutscher Zukunftspreis” 2024 with innovative silicon carbide solution |
|
Munich, Germany – 11 September 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has been nominated for the Deutscher Zukunftspreis 2024, the Federal President’s Award for Technology and Innovation, for its development of a new type of energy-saving chip based on the innovative semiconductor material silicon carbide (SiC). The Jury of Deutscher Zukunftspreis has announced the three nominated teams today in Munich. A team of developers from Infineon, together with Chemnitz University of Technology, has succeeded in developing the world's first silicon carbide MOSFET with a vertical channel (trench MOSFET) and innovative copper contacting in the 3300V voltage class. The new SiC modules and the power converters equipped with the modules represent a revolutionary innovation leap in semiconductor technology from conventional silicon to more energy-efficient silicon carbide, which reduces switching losses in high-current applications by 90 percent. |
|
|
| 11.09.2024 10:00 |
Infineon pioneers world’s first 300 mm power gallium nitride (GaN) technology – an industry game-changer |
|
Munich, Germany and Villach, Austria – 11 September 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that the company has succeeded in developing the world’s first 300 mm power gallium nitride (GaN) wafer technology. Infineon is the first company in the world to master this groundbreaking technology in an existing and scalable high-volume manufacturing environment. The breakthrough will help substantially drive the market for GaN-based power semiconductors. Chip production on 300 mm wafers is technologically more advanced and significantly more efficient compared to 200 mm wafers, since the bigger wafer diameter offers 2.3 times more chips per wafer.
|
|
|
| 10.09.2024 11:15 |
Infineon announces StrongIRFET™ 2 power MOSFET 30 V portfolio for mass market applications |
|
Munich, Germany – 10 September 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is introduced its new StrongIRFET™ 2 power MOSFET 30 V portfolio, expanding the existing StrongIRFET 2 family to address the growing demand for 30 V solutions in the mass market segment. Optimized for high robustness and ease-of-use, the new power MOSFETs were specifically designed to meet the requirements of a wide range of mass market applications, enabling high design flexibility. Amongst these applications are industrial switched-mode power supplies (SMPS), motor drives, battery-powered applications, battery management systems, and uninterruptible power supplies (UPS). |
|
|
| 05.09.2024 15:45 |
Roborock uses hybrid Time-of-Flight system by Infineon and pmdtechnologies for sweeping and mopping robots |
|
Munich, Germany – 5 September 2024 – Roborock, a global leader in intelligent home robotics, has launched the intelligent sweeping and mopping all-in-one robot Roborock Qrevo Slim at IFA 2024 in Berlin, equipped with an innovative 3D camera module for navigation and obstacle avoidance using the REAL3™ Time-of-Flight (ToF) imager by Infineon Technologies (FSE: IFX / OTCQX: IFNNY). The technology allows to reduce size and increase reliability. Compared to the body height of traditional sweeping and mopping robots of around 100 mm, the overall height of the Roborock Qrevo Slim is only 82 mm, allowing it to pass through lower and narrower spaces while providing high reliability. |
|
|
| |
««
«
13
14
15
16
17
»
»»
|
|
|
|
|
|
