| 11.04.2016 13:15 |
Infineon Successfully Completes $935 Million US private placement |
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Munich, Germany – April 11, 2016 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has successfully completed a $935 million US private placement of notes. This is the first such transaction in the company’s history. The proceeds of the transaction will replace the five-year US Dollar term loan g... |
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| 04.04.2016 15:15 |
Lenovo selects embedded security solutions from market leader Infineon |
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Munich, Germany – April 4, 2016 – The new Lenovo ThinkPad® notebooks will be equipped with OPTIGA™ TPM (Trusted Platform Module) chips by Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY). The world's leading PC manufacturer thus responds to an increase of networking and associated security risks... |
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| 22.03.2016 12:30 |
Infineon scores in Multiphase Power Systems with Integrated Power Stage for servers and other demanding systems |
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Munich, Germany and Long Beach, USA – March 22, 2016 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced its integrated power stage family. With power efficiency rating reaching 96 percent, the new power stage devices can be combined with Infineon’s latest generation digital PWM po... |
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| 21.03.2016 13:45 |
Infineon presents world’ smallest plug-and-play NFC security module for smart wearables |
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Munich, Germany and Beijing, China – March 21, 2016 – From fitness trackers and smart keys to chains, watches or wristbands – smart wearables of all kinds are increasingly including mobile payment functionality. Wearable manufacturers are thus challenged to equip even the smallest of devices with se... |
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| 11.03.2016 15:00 |
CoolMOS™ CE in SOT-223 package as cost-effective drop-in replacement for DPAK |
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Munich, Germany – March 11, 2016 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is growing the portfolio of CoolMOS™ CE with a SOT-223 package. For Infineon’s CoolMOS, this package offers a cost effective alternative to DPAK as well as space savings in some designs with low power dissipation. ... |
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| 07.03.2016 10:00 |
TTTech and Infineon to speed up the development in autonomous driving |
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Munich, Germany and Vienna, Austria – March 7, 2016 – Under the guidance of AUDI AG, TTTech developed the central platform control unit “zFAS” integrating various functionalities of advanced driver assistance systems (ADAS). The ECU also enables comprehensive fusion of sensor data. Microcontrollers ... |
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