| Press Releases 97 to 102 of 1639 |
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| 05.03.2024 08:15 |
Infineon introduces CoolSiC™ MOSFET G2, the next generation of silicon carbide technology for high-performance systems that drive decarbonization |
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Munich, Germany - March 5, 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) opens a new chapter in power systems and energy conversion and introduces the next generation of silicon carbide (SiC) MOSFET trench technology. The new Infineon CoolSiC™ MOSFET 650 V and 1200 V Generation 2 improve MOSFET key performance figures such as stored energies and charges by up to 20 percent compared to the previous generation without compromising quality and reliability levels leading to higher overall energy efficiency and further contributing to decarbonization. |
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| 01.03.2024 10:15 |
Infineon enhances the TRAVEO™ T2G MCU family with Qt Group graphics solution to enable intelligent rendering technologies |
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Munich, Germany – 1 March 2024 – In the highly competitive global semiconductor market, manufacturers are constantly striving for shorter time-to-market. At the same time, the demand for fluid and high-resolution graphical displays is increasing. To address these market demands, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announces its strategic collaboration with Qt Group, a global software company providing cross-platform solutions for the entire software development lifecycle. This collaboration brings Qt's lightweight, high-performance graphics framework to Infineon's graphics-enabled TRAVEO™ T2G cluster microcontrollers and represents a paradigm shift in graphical user interface (GUI) development. |
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| 29.02.2024 10:15 |
PSoC™ Automotive 4100S Max supports fifth generation CAPSENSE™ technology with higher performance |
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Munich, Germany – 29 February, 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched the new Automotive PSoC™ 4100S Max family. This microcontroller device family expands Infineon’s portfolio of CAPSENSE™ enabled Human Machine Interface (HMI) solutions for automotive body/HVAC and steering wheel applications by delivering higher flash densities, GPIOs, CAN-FD, and HW-Security. |
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| 28.02.2024 11:15 |
Infineon introduces new Solid-State Isolators to deliver faster switching with up to 70 percent lower power dissipation |
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Munich, Germany, and Long Beach, California - 28 February 2024 – Today at the Applied Power Electronics Conference (APEC), Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduced a new product family of Solid-State Isolators to achieve faster and more reliable circuit switching with protection features not available in optical-based solid state relays (SSR). The isolators use coreless transformer technology and support 20 times greater energy transfer with both current and temperature protection contributing to a higher reliability and lower cost of ownership. The new solid-state isolators allow driving the gates of Infineon’s MOS-controlled power transistors OptiMOS ™ and CoolMOS™ to reduce power dissipation of up to 70 percent of todays’ solid-state relays using SCR (silicon-controlled rectifier) and Triac switches. |
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| 28.02.2024 09:30 |
Infineon reorganizes sales and marketing to boost customer centricity and lead in application support |
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Munich, Germany – 28 February 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is setting the course for ambitious growth by further strengthening and streamlining its sales organization. Starting 1 March, Infineon’s sales team will be structured around three customer-centric Sales Segments: “Automotive”, “Industrial & Infrastructure” and “Consumer, Computing & Communication”. The DEM sales organization will retain responsibility for distributors and Electronics Manufacturing Services (EMS). This new structure will further leverage the potential of Infineon’s comprehensive and diverse product portfolio by putting customers’ application needs at the center of the new organizational model. All of these organizations will be deployed globally with an optimized regional footprint. |
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| 27.02.2024 14:15 |
Infineon advances automotive and industrial solutions with newly launched CoolSiC™ MOSFET 750 V G1 product family |
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Munich, Germany – 27 February 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the 750V G1 discrete CoolSiC™ MOSFET to meet the increasing demand for higher efficiency and power density in industrial and automotive power applications. The product family includes both industrial-graded and automotive-graded SiC MOSFETs that are optimized for totem-pole PFC, T-type, LLC/CLLC, dual active bridge (DAB), HERIC, buck/boost, and phase-shifted full bridge (PSFB) topologies. The MOSFETs are ideal for use in both typical industrial applications, such as electric vehicle charging, industrial drives, solar and energy storage systems, solid state circuit breaker, UPS systems, servers/datacenters, telecom, and in the automotive sector, such as onboard chargers (OBC), DC-DC converters, and many more. |
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