| Press Releases 1 to 6 of 1572 |
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| 15.05.2024 10:15 |
Infineon presents XENSIV™ TLE49SR angle sensor family with outstanding stray field robustness |
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Munich, Germany – 15 May 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the new XENSIV™ TLE49SR angle sensor family, which combines excellent stray field immunity with high accuracy. The sensors are ideal for applications of safety-critical automotive chassis systems such as electric power steering and vehicle height leveling. |
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| 14.05.2024 18:00 |
Infineon extends Management Board contracts of Andreas Urschitz and Rutger Wijburg |
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Munich, Germany – 14 May 2024 – The Infineon Technologies AG Supervisory Board has extended the contract of Dr. Rutger Wijburg (62), Management Board member and Chief Operations Officer, for a period of one year, until 31 March 2026. In addition, the Supervisory Board will extend the contract of Andreas Urschitz (52), Management Board member and Chief Marketing Officer, for a period of five years, until 31 May 2030. The current contract of Andreas Urschitz expires at the end of May 2025; Rutger Wijburg's contract would otherwise have expired in March 2025. |
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| 07.05.2024 07:33 |
Solid Q2 FY 2024. Prolonged weak demand in major target markets leads to a lowering of the forecast for the fiscal year. Program to strengthen competitiveness starts. |
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Neubiberg, 7 May 2024 – Today, Infineon Technologies AG is reporting results for the second quarter of the 2024 fiscal year (period ended 31 March 2024). |
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| 06.05.2024 10:00 |
Infineon provides a broad range of products for Xiaomi’s new SU7 smart electric vehicle |
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Munich, Germany, Shanghai, China – 6 May 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global semiconductor leader in power systems and IoT, will provide silicon carbide (SiC) power modules HybridPACK™ Drive G2 CoolSiC™ and bare die products to Xiaomi EV for its recently announced SU7 until 2027. Infineon’s CoolSiC-based power modules allow for higher operating temperatures, resulting in best-in-class performance, driving dynamics and lifetime. Traction inverters based on the technology can, for example, further increase electric vehicle range. The HybridPACK Drive is Infineon’s market-leading power module family for electric vehicles, with almost 8.5 million units sold since 2017. |
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| 03.05.2024 11:15 |
Infineon introduces PSoC™ 4 HVPA-144K microcontroller for automotive battery management systems |
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Munich, Germany – 3 May 2024 – With the introduction of the PSoC 4 High Voltage Precision Analog (HVPA)-144K microcontroller, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) addresses the automotive battery management sector by integrating high-precision analog and high-voltage subsystems on a single chip. It provides a fully integrated embedded system for monitoring and managing automotive 12 V lead-acid batteries, which is critical for the 12 V power supply of vehicles' electrical systems. The new microcontroller is ISO26262 compliant, enabling compact and safe intelligent battery sensing and battery management in modern vehicles. |
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| 29.04.2024 10:15 |
Infineon and ETAS collaborate to optimize security of next-generation AURIX™ microcontrollers with ESCRYPT CycurHSM |
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Munich and Stuttgart, Germany – 29 April 2024 – As the automotive industry transitions to software-defined vehicles and new E/E architectures, the demand for high-performance hardware and robust cybersecurity solutions increases. To address this requirement, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has integrated the ESCRYPT CycurHSM 3.x Automotive Security Software Stack into the AURIX™ TC4X Cybersecurity Real-time Module (CSRM) in collaboration with ETAS, a provider of automotive software. With this next-generation solution bundle, ETAS and Infineon strive to optimize security levels, performance, and functionality. |
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