Infineon Introduces New XC2200M Microcontroller Series; Adds Multiply Accumulate Unit to High-Performance MCU Family for Automotive Body Applications
Neubiberg, Germany – September 30, 2008 – Infineon Technologies (FSE/NYSE: IFX) today introduced a new series of highly-integrated microcontrollers designed for use in automotive body applications, featuring very low power consumption in stand-by and operation mode, higher performance and AUTOSAR compliance. The new XC2200M series of the XC2200 family fulfils the demanding requirements of BCM (Body Control Module) applications such as internal and external lighting systems, car access and door modules; Central Gateway applications that manage all internal interfaces (i.e. motor management, in-car entertainment, dashboard or convenient control) and the communication with external interfaces for after-sales software updates; and HVAC (Heating Ventilation Air Conditioning) applications.

The XC2200M series further extends the XC2000 family product portfolio with support for AUTOSAR in body applications, including a memory protection Unit (MPU) to protect user-specified memory areas from unauthorized read, write or instruction fetch accesses. Infineon’s XC2200M series offers a very low power consumption of about 20 mA at 20 MHz over the full temperature range. This low power consumption results in reduced system costs as design engineers are allowed to choose smaller voltage regulators. To fulfill the increasing demand of communication peripherals in Body Gateway and BCM applications, the XC2200M series supports six CAN nodes with 256 Message Objects, a common feature of the XC2200 family, and increases the number of Universal Interfaces from six to now eight. To improve performance for sensorless motor drive applications like ripple count for window lift, the XC2200M products offer a Multiply Accumulate (MAC) unit with DSP functionality for dedicated filter algorithm. Using the MAC unit allows the XC2200M to potentially control more window lifts or more motors in seat applications than currently available microcontrollers.

XC2200M Products Launched: the XC2267M and XC2287M

The two XC2200M series devices introduced today, the XC2267M and XC2287M, include up to 832 kBytes of on-chip flash memory, up to 24 ADC channels, 8 flexible USIC channels, 6 CAN nodes and up to 32 PWM (Puls Width Modulation) channels. Based on the high-performance C166SV2 core and optimized for body applications, XC2200 family MCUs operate at up to 80 MHz frequency. Available package options are the green (lead-free) Low-Quad Flat Pack LQFP-100 and -144 for a temperature range from -40 °C of up to +125 °C.

Availability and Development Tool Support

Samples of the XC2200M devices are available for dedicated automotive customers. Volume production of the new devices is scheduled to start beginning of 2009.

The XC2200M products are supported by the full suite of development tools, including evaluation boards, debuggers, compilers and documentation.

Further information on Infineon’s automotive semiconductor portfolio and XC2200 family is available at http://www.infineon.com/automotive and http://www.infineon.com/xc2200
About Infineon

Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications, and security. In the 2007 fiscal year (ending September), the company reported sales of Euro 7.7 billion (including Qimonda sales of Euro 3.6 billion) with approximately 43,000 employees worldwide (including approximately 13,500 Qimonda employees). With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX).Further information is available at www.infineon.com.
 
 
 
» Infineon Technologies
» Press Releases
» Press Release
Date: 30.09.2008 14:45
Number: INFAIM200809.095
» Contacts
Infineon Technologies AG

Media Relations
Tel: +49-89-234-28480
Fax: +49-89-234-9554521
media.relations@infineon.com

Investor Relations:
Tel: +49 89 234-26655
Fax: +49 89 234-9552987
investor.relations@infineon.com
» More Press Releases
21.11.2024 10:15
AURIX™ TC3x from Infineon supports FreeRTOS

20.11.2024 10:15
Dependable power distribution with eFuses: Infineon launches PROFET™ Wire Guard with integrated I²t wire protection

19.11.2024 12:00
Infineon and Quantinuum announce partnership to accelerate quantum computing towards meaningful real-world applications

18.11.2024 14:15
Infineon delivers industry’s first radiation-hardened-by-design 512 Mbit QML-qualified NOR Flash for space industry applications

13.11.2024 14:15
OptiMOS™ Linear FET 2 MOSFET ermöglicht optimalen Hot-Swap- und Batterieschutz