Infineon 3G low-cost solution enables Enhanced Mobile Internet for Emerging Markets

Neubiberg, Germany and Barcelona, Spain – February, 16, 2009 – Infineon Technologies AG (FSE/NYSE: IFX) today announced a new low-cost platform solution enabling fast Mobile Internet access with a cost-optimized 3G network connectivity. The Infineon XMM™ 6130 sets a new standard offering a competitive, cost optimized 3G solution for enhanced mobile internet experience with higher data rates provided by 3G HSDPA. The platform is housing the X-GOLD™ 613, a cellular System-on-Chip, comprising of monolithically integrated 2G /3G digital and analog baseband plus power management functionality. It is manufactured in 65nm CMOS technology. Infineon’s latest baseband solution is taking the next step in bringing enhanced modem features such as HSDPA to the mass market. “With global 3G network rollout increasingly finding traction, there is a growing need to bring the benefits of 3G connectivity to the low-cost segment of the market. Here Infineon is paving the way for this target group to have internet access and more mobile applications at an affordable price”, says Weng Kuan Tan, Vice President and Division President for the Wireless Division at Infineon. “Having proven to be uniquely successful mobile phones are now for many the only means of gaining access to the Internet. With our XMM 6130 we help to bring cost effective 3G solutions to a mass market.” XMM 6130 follows on the success of the Infineon XMM™2130 platform, presented at last years Mobile World Congress, which brought Internet Browsing, Music and Video, 3 megapixel Camera, FM Radio and Messaging into the low-cost market. The newly introduced 3G solution expands the functionality from EDGE to 3G and allows customers to significantly reduce the production cost of core mobile functions and realize fully function 3G mobile internet devices thus enabling a new class of truly competitive Entry 3G phones. It underlines once again Infineon’s competence in offering semiconductor and system solutions addressing one of the central needs to modern society – namely being able to communicate. About the X-GOLD™ 613 A flagship device, the X-GOLD 613 is Infineon’s first baseband dedicated to the low-cost Entry 3G markets. The chip is designed for low-cost cellular phones and brings together a powerful ARM11 based MCU, rich multimedia features with dedicated interfaces for camera, display, USB, memory cards and the benefits of a 3G air interface. The device supports, together with Infineon’s low-cost 2G/3G RF transceiver SMARTi™ UEmicro, the complete HSDPA (3.6Mbps) modem functionality up to 3G Dual-band and up to Quad-band EDGE. The XMM™ 6130 platform solution includes a reference design, a complete RF engine, an integrated Release 6 dual-mode protocol stack with a common software API layer (UTA), and the Infineon Multimedia Framework, User Interface & Application framework. Availability The XMM 6130 / X-GOLD 613 will sample in June 2009 and will be available in volume quantities in the first half of 2010. http://www.infineon.com/X-GOLD613

About Infineon Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications, and security. In the 2008 fiscal year (ending September), the company reported sales of Euro 4.3 billion with approximately 29,100 employees worldwide. With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX).