Infineon Presents MIPAQ base Module with Integrated Shunts at PCIM China

Neubiberg, Germany and Shanghai, China – June 3, 2009 – At the PCIM China Exhibition and Conference in Shanghai, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced high-volume availability of its IGBT (Insulated Gate Bipolar Transistor) MIPAQ™ base modules. The MIPAQ (Modules Integrating Power, Application and Quality) base module integrates an IGBT six-pack and current sense shunts and is ideally suited for use in low-induction system designs in industrial drives and servos up to 55 kW. The MIPAQ base module is characterized by enhanced testing and is delivered as a known-good system. Only 17 mm in height, the MIPAQ base module enables highly efficient and compact power inverter designs of high ruggedness at an excellent price/performance ratio. The MIPAQ base module integrates three specifically designed shunts for current measurement. The integrated shunts handle all tasks formerly performed by external current sensors, which are costly and require valuable space. They allow its applications to greatly benefit from board space savings of up to 20 square centimeters and elimination of PCB hotspots. Physical effects like hysteresis or offset do not exist. The integrated shunts also generate significantly less heat on an inverter’s PCB. The integration into the “MIPAQ base” module provides better heat distribution to the heatsink. Using Infineon’s TRENCHSTOP™ / fieldstop IGBT4 chip technology with emitter controlled diodes, MIPAQ base modules feature a nominal current of 75 A, 100 A and 150 A in a 1200 V class for the six-pack configuration with NTC resistor for temperature sensing. The maximum operating junction temperature is +150 °C. They are available in Infineon’s EconoPACK™ 3 housing and are RoHS-compliant. MIPAQ: A Family of Three The MIPAQ IGBT module family, with integrated sensing and driver electronics, supports design of powerful and compact inverters for low and medium power at low costs, contributing to energy savings to improve profitability and protect our environment at the same time. The MIPAQ family today includes three products. The MIPAQ base module (now in high-volume production), the MIPAQ sense module that offers an additional current measurement feature that is fully digital with galvanically isolated output signals, and the MIPAQ serve module that includes adapted driver electronics. Availability of MIPAQ base, MIPAQ sense and MIPAQ serve Volume production of MIPAQ base has started. Samples of the modules MIPAQ sense and MIPAQ serve are available. Start of production for MIPAQ serve is scheduled for Q3 2009, for MIPAQ sense for Q1 2010. Infineon at PCIM China 2009 Show Infineon is demonstrating the MIPAQ base module in its Booth #P205, W2 the PCIM China 2009 Exhibition and Conference (Shanghai, China, Everbright Convention & Exhibition Center, June 2-4). For an overview of Infineon’s conference presentations please see http://www.mesago-online.de/en/PCChina/Program/index.htm Further information on Infineon’s latest Smart modules and MIPAQ modules is available at www.infineon.com/highpower. For Infineon’s product portfolio of power semiconductors and modules please go to www.infineon.com/power

About Infineon Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications, and security. In the 2008 fiscal year (ending 30 September), the company reported sales of EUR 4.3 billion with approximately 29,100 employees worldwide in continuing operations. With a global presence, Infineon operates through its subsidiaries in the United States from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the United States on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY). Further information is available at www.infineon.com