Infineon Introduces EconoDUAL™ 3 Power Modules with Automotive Qualification, Offering Both Highest Power Density and Reliability

Neubiberg / Nuremberg, Germany – May 14, 2013 – At PCIM Europe 2013 in Nuremberg (May 14-16, 2013), Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches its new EconoDUAL™ 3 IGBT modules, which are fully qualified according to automotive standards. The new offering addresses demanding applications in commercial, construction or agricultural vehicles where extended reliability is a key. Automotive qualification means that the modules provide significantly increased thermal cycling and thermal shock capability, while a new soft diode improves the EMI behavior. “Extending the well-established EconoDUAL™ 3 family by fully automotive qualified products, Infineon takes full advantage of its decade-long experience both in developing and producing IGBT modules as well as handling and fulfilling specific automotive requirements,” says Zhang Xi, Manager Technical and Product Marketing at Infineon Technologies. “In addition, the further improved reliability specifications fulfill even highest demands of extremely demanding applications.” The optimized design and assembly technology of the new automotive qualified EconoDUAL™ 3 modules enables a more than three times higher thermal cycling capability, while the thermal shock capability is increased by a factor of ten compared to the industry standard. With excellent mechanical robustness and power cycling capability, as well as the option of PressFit pins, Infineon offers a reliable, cost effective solution for various applications in vehicles. The modules of the EconoDUAL™ 3 series offer the highest power density (up to 600A/1200V) available within this module footprint. The modules provide superior switching performance while copper wire bonding leads to a reduced internal lead resistance. With the use of copper bonding technology as well as an improved DCB the output power can be increased by up to 30% when compared to the related 450A version. To facilitate logistics handling and traceability, all Infineon IGBT modules are considered as unique and fully-labeled on the modules. In case of the newly presented EconoDUAL™ 3 modules, integrated DMX code chips provide the possibility of an even enhanced traceability for automated identification of the assembled components. Availability Samples of the automotive qualified EconoDUAL™ 3 modules FF400R12ME4A_B11 (400A, 1200V) and FF600R12ME4A_B11 (600A, 1200V) will be available in Q4 2013, with volume production planned in the second half of 2014. Further information on the EconoDUAL™ 3 modules and the EconoDUAL product family is available at www.infineon.com/dual3.

About Infineon Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, mobility, and security. In the 2012 fiscal year (ending September 30), the Company reported sales of Euro 3.9 billion with close to 26,700 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY). Further information is available at www.infineon.com.