ELTEC Sets new Performance Levels with Innovative COM Express Module

Powerful design based on Dual-Core Intel® Xeon® processor and high-end chipset enables high computing performance with low power consumption Mainz, Germany, April 27, 2006 - ELTEC Elektronik AG introduces the COM (Computer On Module) Express CPU module EUROCOM 400 with the new Dual-Core Intel® Xeon® processor LV 2.0 GHz. Next to its twin cores, the processor also features dual CPU capabilities. Due to the latest CPU technology, the high performance of the new processor is combined with low power consumption of the CPU: only 31 watts. Benchmark tests showed that the EUROCOM 400 – using related software  - more then doubles the performance compared to other single CPU or dual core approaches. Moreover, ELTEC is also using the Intel® E7520 chipset which provides a basis on the COM Express module for a higher system performance (also thanks to the 8 lane PCI Express connection to the carrier board). The architecture of the module allows a fast data transfer simultaneously on multiple channels (e.g. Gb Ethernet, also with real-time Ethernet implementations, simultaneous Raid accesses and process data transfers). Up to 4 GByte RAM (also with ECC) can be implemented. A further distinctive feature of the module is the availability of graphics (SM 712 with internal graphics). The combination of graphics and high-end server performance opens a wide field of demanding industrial applications. The usage of a COM Express module requires a carrier board, providing the related I/Os. From ELTEC a carrier board with complete I/O for development purposes and standard-production application is available for the EUROCOM 400 COM Express module.