Press Releases 1 to 6 of 222
22.01.2025 14:00 ROHM’s 2nd Generation MUS-IC™ Series Audio DAC Chip for Hi-Res Audio Playback with Exclusive HD Monaural Mode
Willich-Münchheide, Germany, January 22, 2025 – ROHM has developed the 32-bit D/A converter IC (DAC chip) and evaluation board designed for flagship models in the MUS-IC™ series optimized for high-resolution audio playback.
15.01.2025 14:00 ROHM Offers the Industry’s Smallest* Terahertz Wave Oscillation and Detection Devices
Willich-Münchheide, Germany, January 15, 2025 – ROHM has begun offering samples of the industry’s smallest* terahertz (THz) wave oscillation and detection devices utilizing semiconductor elements known as Resonant Tunneling Diodes (RTDs). Terahertz waves are anticipated to be applied to non-destructive testing, imaging, and sensing in the medical and healthcare sectors, as well as potentially future ultra-fast communication technologies. Providing these devices contributes to the advancement of terahertz wave applications.
07.01.2025 14:00 ROHM Develops a 1kW Class High Power Infrared Laser Diode
Willich-Münchheide, Germany, January 07, 2025 – ROHM has developed a high output laser diode - RLD8BQAB3 - for use in ADAS (Advanced Driver Assistance Systems) equipped with LiDAR for distance measurement and spatial recognition. ROHM will initially start supplying samples targeting consumer and industrial applications such as drones, robot vacuum cleaners, AGVs (Automated Guided Vehicles), and service robots.
12.12.2024 14:00 ROHM’s PMICs for SoCs have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits
Willich-Münchheide, Germany, December 12, 2024 – ROHM has announced the adoption of its PMICs in power reference designs focused on the next-generation cockpit SoCs ‘Dolphin3’ (REF67003) and ‘Dolphin5’ (REF67005) by Telechips, a major fabless semiconductor manufacturer for automotive applications headquartered in Pangyo, South Korea. Intended for use inside the cockpits of European automakers, these designs are scheduled for mass production in 2025.
10.12.2024 14:00 ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for Automotive Industry
Willich-Münchheide, Germany, December 10, 2024 – ROHM Co., Ltd. (ROHM) announced today that ROHM and TSMC have entered a strategic partnership on development and volume production of gallium nitride (GaN) power devices for electric vehicle applications.
04.12.2024 14:00 ROHM’s EcoSiC™ Technology has been Adopted in COSEL’s HFA/HCA Series of 3.5kW Output AC-DC Power Supply Units
Willich-Münchheide, Germany, December 04, 2024 – ROHM has announced the adoption of its EcoSiC products, including SiC MOSFETs and SiC Schottky barrier diodes (SBDs) in the HFA/HCA series of 3.5kW output AC-DC power supply units for 3-phase applications from COSEL, a leading power supply manufacturer in Japan. Incorporating ROHM SiC MOSFETs and SiC SBDs into the forced air-cooled HFA series and conduction-cooled HCA series achieves up to 94% efficiency. The HCA series has been mass produced since 2023, while the HFA series began mass production in 2024.
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